TSM-106-04-TM-DH-P-TR SAMTEC Connector (Other) In Stock
TSM-106-04-TM-DH-P-TR is a SAMTEC 12-position dual-row surface-mount terminal strip with 0.100 inch pitch, tape-and-reel packaging for automated assembly, and gold-plated contacts for reliable board-to-board signal routing. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- TSM-106-04-TM-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-106-04-TM-DH-P-TR?
- 12-position dual-row terminal strip with 0.100 inch pitch provides a standard-density board-to-board interconnect in SMT format
- Tape-and-reel (TR) packaging supports high-volume automated pick-and-place assembly with minimal handling overhead
- Gold-plated contact surfaces ensure consistent low-resistance mating over repeated connector insertion cycles
- Surface-mount termination eliminates through-hole drilling requirements, simplifying PCB fabrication for dense SMT board designs
What is TSM-106-04-TM-DH-P-TR used for?
TSM-106-04-TM-DH-P-TR is used in surface-mount board-to-board and board-to-wire interconnect designs requiring a standard 0.100 inch pitch 12-position dual-row terminal strip. Its tape-and-reel packaging makes it well suited for high-volume automated assembly of industrial control boards, embedded computing modules, and consumer electronics requiring compact SMT header connections. The dual-row configuration doubles the circuit density compared to a single-row alternative at the same 0.100 inch pitch.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-106-04-TM-DH-P-TR datasheet?
TSM-106-04-TM-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-106-04-TM-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many circuits does TSM-106-04-TM-DH-P-TR support and how are they arranged on the PCB?
TSM-106-04-TM-DH-P-TR supports 12 positions arranged in a dual-row configuration with 0.100 inch pitch between adjacent contacts. The dual-row layout places 6 contacts per row, providing 12 circuits within a compact surface-mount footprint that occupies roughly half the PCB length of a single-row 12-position connector at the same 0.100 inch pitch.
Why is the tape-and-reel packaging of TSM-106-04-TM-DH-P-TR important for high-volume PCB assembly operations?
The tape-and-reel (TR) packaging of TSM-106-04-TM-DH-P-TR allows the connector to be loaded directly into automated pick-and-place feeders, enabling precise and repeatable SMT placement at production line speeds. This eliminates the labor cost and placement inconsistency of manual insertion, making it essential for high-volume assembly runs where 12-position dual-row connectors must be placed accurately on hundreds or thousands of PCBs per shift.
For a 0.100 inch pitch dual-row surface-mount interface, when is TSM-106-04-TM-DH-P-TR preferred over a through-hole terminal strip?
TSM-106-04-TM-DH-P-TR is preferred over through-hole alternatives when the PCB design uses a fully surface-mount assembly process, since the SMT footprint avoids the 12 through-holes that a through-hole terminal strip would require. This simplifies PCB stackup design, eliminates wave soldering steps for these connectors, and supports placement on double-sided SMT boards where through-hole access is restricted by opposite-side components.
Which embedded computing and industrial applications are best served by TSM-106-04-TM-DH-P-TR's 12-position 0.100 inch pitch configuration?
Embedded computing daughter cards, industrial sensor interface boards, and programmable logic controller (PLC) expansion modules are well served by TSM-106-04-TM-DH-P-TR. The 0.100 inch pitch is a widely used standard spacing in these markets, ensuring broad mating header compatibility, while the 12-position dual-row format provides enough circuits for mixed signal and power distribution interfaces typical of industrial I/O expansion designs.
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