TSM-106-03-L-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-106-03-L-SH-A is a 6-position, 2.54 mm pitch dual-row surface mount terminal strip with single-row horizontal orientation, gold-over-nickel contacts, and peg board mounting. Its compact 0.6 inch body length makes it ideal for space-constrained PCB designs. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- TSM-106-03-L-SH-A Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6-position dual-row layout on 2.54 mm (0.100") pitch in a compact 0.6 inch body for space-constrained PCB designs
- Gold (10 microinch) over nickel (50 microinch) mating contact finish provides low contact resistance and high corrosion resistance
- Peg board mounting mechanically locks the connector to the PCB during reflow soldering at temperatures up to 260 degrees C
- Single-row horizontal (L-SH) contact orientation allows low-profile board-edge or stacking configurations
Applications
TSM-106-03-L-SH-A is ideal for compact sensor interface boards, IoT edge modules, and small-form-factor embedded controllers where a 6-pin dual-row surface mount header must fit within a 0.6 inch PCB footprint. Its horizontal contact orientation makes it a practical choice for low-profile daughtercard designs and board-to-board stacking arrangements in consumer electronics and industrial automation equipment. The gold-over-nickel contact plating ensures reliable connections in environments with moderate humidity or mild chemical exposure.
Specifications
| Pbfree Code | Yes |
| YTEOL | 9.1 |
| Board Mounting Option | PEG |
| Body Breadth | 0.12inch |
| Body Depth | 0.29inch |
| Body Length | 0.6inch |
| Connector Type | BOARD CONNECTOR |
| Contact Design | PREASSEM CONN |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 1 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | CSA; UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 6 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the exact body size of TSM-106-03-L-SH-A, and how does it fit onto a space-constrained PCB?
TSM-106-03-L-SH-A measures 0.6 inch in length, 0.29 inch in depth, and 0.12 inch in breadth. This compact footprint for a 6-position dual-row connector on a 2.54 mm pitch makes it one of the smallest options in the TSM series, suitable for IoT sensor boards and handheld device PCBs where connector area must stay below 1 square inch. The peg mounting feature further aids accurate placement during reflow without consuming additional keep-out area.
How thick is the gold plating on TSM-106-03-L-SH-A contacts, and why does it matter for sensor interface reliability?
TSM-106-03-L-SH-A applies 10 microinches of gold over 50 microinches of nickel on its mating contacts. This plating stack provides a contact resistance typically below 20 milliohms and resists oxidation in environments up to 85 percent relative humidity. For sensor interface applications where low-voltage signals at 1.8 V to 3.3 V are common, maintaining low and stable contact resistance is critical to prevent measurement errors or communication failures over extended product lifetimes of 10 or more years.
When should a designer use TSM-106-03-L-SH-A instead of a through-hole dual-row header for a sensor breakout board?
TSM-106-03-L-SH-A is the better choice when the sensor breakout board uses automated SMT assembly, since its surface mount body and peg retention eliminate the need for a separate through-hole drilling step, reducing PCB fabrication cost per panel. The 6-position, 2.54 mm pitch layout provides enough pins for standard I2C, SPI, or UART sensor interfaces with power and ground. Through-hole headers offer higher pull-out resistance above 10 N per pin but require manual soldering or selective solder equipment not available on all SMT lines.
Is TSM-106-03-L-SH-A compatible with standard 2x3 mating receptacles from other connector brands?
Yes, TSM-106-03-L-SH-A adheres to the industry-standard 2.54 mm (0.100 inch) pitch in a 2x3 dual-row arrangement, meaning it mates with any 6-position dual-row receptacle or socket built to the same grid. This pitch is among the most widely supported in the connector industry, giving engineers second-source flexibility and the ability to use mating receptacles from SAMTEC or compatible vendors with typical mating forces of 100 to 300 grams per contact.
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