TSM-106-01-FM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-106-01-FM-DH-A-K-TR is a 12-position, single-row, 0.100 inch pitch surface-mount terminal strip with dual-height mating capability and anti-solder-wicking contacts. It provides reliable board-to-board or wire-to-board connectivity with tape-and-reel packaging for automated SMT assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-position single-row layout on standard 0.100 inch (2.54 mm) pitch compatible with industry-standard IDC cables and PCB footprints
- Dual-height (DH) mating configuration accommodates both standard and tall mating headers for flexible stack height options
- Anti-solder-wicking (A suffix) contact prevents flux contamination of the mating zone during SMT reflow soldering
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place assembly on standard SMT production lines
Applications
The TSM-106-01-FM-DH-A-K-TR is suited for industrial control boards, sensor breakout modules, and embedded development platforms that require a compact 12-pin board-to-board or board-to-cable interface at the standard 0.100 inch pitch. Its dual-height mating range accommodates PCB stack variations in backplane and motherboard-daughtercard assemblies, reducing the need for multiple connector variants across product families. The anti-solder-wicking feature ensures signal integrity in fine-pitch SMT assemblies processed through lead-free reflow profiles up to 260 °C.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What mating height range does the DH (dual-height) option of TSM-106-01-FM-DH-A-K-TR provide?
The dual-height (DH) designation in TSM-106-01-FM-DH-A-K-TR indicates that the socket accepts mating pins at two different insertion depths, typically covering a stack height range from approximately 8.5 mm to 11.0 mm above the PCB surface. This flexibility allows a single SMT socket to mate with standard-profile and tall-profile male pin headers across different enclosure depths, eliminating the need to stock two separate socket variants for product lines with variable board-to-board spacing requirements.
How does the anti-solder-wicking design protect the 12-pin contact array during lead-free reflow?
During lead-free reflow at peak temperatures up to 260 °C, molten solder can wick up the contact shank by capillary action and deposit flux residue inside the mating socket cavity of a 0.100 inch pitch connector. The anti-solder-wicking (A) feature incorporates a geometric barrier on each of the 12 contacts that arrests this capillary flow, keeping the mating zone free of flux and ensuring contact resistance stays below 20 milliohms after assembly, which is critical for reliable low-level signal connections on sensor interface boards.
Can TSM-106-01-FM-DH-A-K-TR replace through-hole terminal strips in a redesign targeting fully automated SMT assembly?
Yes, the TSM-106-01-FM-DH-A-K-TR is a surface-mount variant of the standard 0.100 inch 12-pin terminal strip, making it a direct functional replacement for through-hole equivalents in boards transitioning to 100% SMT assembly. Eliminating through-hole drilling for 12 pins can reduce PCB fabrication cost by several percent on a 4-layer board, and the tape-and-reel packaging enables automated placement at rates above 3000 components per hour, removing the manual insertion step that accounts for a significant share of labor cost in mixed-technology assembly lines.
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