TSM-104-01-S-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-104-01-S-DH-A-P-TR is an 8-position dual-row 2.54mm pitch surface mount terminal strip with 30 microinch gold over nickel mating contacts and tin termination. Features E.L.P. (Extended Life Plating) and tape-and-reel packaging for high-reliability automated SMT assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TSM-104-01-S-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8-position dual-row layout with 2.54mm (100mil) pitch in a compact 0.4 x 0.24 inch SMT body suits space-constrained PCB designs
- 30 microinch gold over 50 microinch nickel contact finish with E.L.P. delivers extended mating cycle life and minimal contact resistance
- Lead-free tin termination with nickel barrier and tape-and-reel packaging supports RoHS-compliant automated SMT production
Applications
TSM-104-01-S-DH-A-P-TR is well-suited for low to moderate pin-count SMT board interconnect applications such as sensor interface boards, small microcontroller modules, and prototype evaluation cards. Its 8-position dual-row layout with E.L.P. gold contacts provides reliable, long-life connections for frequently accessed debug, programming, or signal test points on compact PCBs.
Specifications
| Pbfree Code | Yes |
| YTEOL | 9.1 |
| Additional Feature | E.L.P. |
| Body Breadth | 0.24inch |
| Body Depth | 0.41inch |
| Body Length | 0.4inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 8 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating specification does TSM-104-01-S-DH-A-P-TR use and why is it important?
TSM-104-01-S-DH-A-P-TR uses 30 microinch gold over 50 microinch nickel on mating contacts, enhanced by SAMTEC's E.L.P. (Extended Life Plating). This specification delivers low contact resistance (below 20 milliohms) and extended durability over repeated mating cycles, making it suitable for connectors that must be reliably engaged and disengaged frequently across all 8 positions.
How does the 8-position count of TSM-104-01-S-DH-A-P-TR make it suitable for sensor or microcontroller interfaces?
The 8-position dual-row format of TSM-104-01-S-DH-A-P-TR accommodates common 4-wire SPI buses, 2-wire I2C, power and ground pairs, or 8 GPIO lines in a single compact 2.54mm-pitch SMT connector. Its small 0.4 x 0.24 inch body fits easily on evaluation boards, sensor breakout modules, and embedded controller cards with minimal footprint impact.
Is TSM-104-01-S-DH-A-P-TR compatible with lead-free reflow soldering processes?
Yes, TSM-104-01-S-DH-A-P-TR is fully lead-free and RoHS compliant, with tin plus nickel barrier termination rated for standard lead-free reflow soldering at temperatures up to 260°C. The tape-and-reel (TR) packaging ensures compatibility with automated pick-and-place SMT lines used in high-volume, RoHS-compliant electronics manufacturing.
When is TSM-104-01-S-DH-A-P-TR a better choice than a through-hole terminal strip for SMT-only board assemblies?
TSM-104-01-S-DH-A-P-TR is the better choice on SMT-only boards where through-hole tooling is unavailable or costly, as it eliminates the need for wave soldering or manual through-hole assembly. Its surface mount pads also provide a lower profile (body depth of 0.41 inch) and enable placement on both sides of a PCB, reducing overall assembly steps and cost for 8-position connector requirements.
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