TSM-104-01-LM-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-104-01-LM-SH-A is a 4-position single-row surface mount terminal strip with 0.100 inch (2.54 mm) pitch in a horizontal orientation, featuring male rectangular contacts with tin-over-nickel termination finish. Its compact body measuring 0.40 x 0.28 x 0.12 inch suits dense SMT PCB layouts. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- TSM-104-01-LM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 4-position single-row 0.100 inch pitch SMT terminal strip for reliable horizontal board-to-wire interconnects in compact PCB designs
- Tin-over-nickel (Sn/Ni) contact termination finish provides corrosion resistance and reliable solderability during reflow assembly
- Surface mount horizontal orientation enables low-profile board edge connections without increasing overall PCB height
Applications
The TSM-104-01-LM-SH-A is suited for low-profile PCB-to-wire and PCB-to-PCB signal interconnects in industrial control modules, consumer electronics, and embedded computing boards where through-hole connectors are not acceptable. Its 4-position 0.100 inch pitch layout accommodates power and signal connections in compact sensor boards, LED driver modules, and small form-factor I/O expansion cards. The surface mount footprint allows full automated reflow assembly, reducing manual connector installation costs in medium- to high-volume production.
Specifications
| YTEOL | 9.1 |
| Body Breadth | 0.12inch |
| Body Depth | 0.28inch |
| Body Length | 0.4inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 1 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 4 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the pitch and position count of the TSM-104-01-LM-SH-A, and what board configurations does this support?
The TSM-104-01-LM-SH-A has 4 positions on a 0.100 inch (2.54 mm) pitch in a single-row horizontal layout. The 4-position count accommodates configurations such as 4-wire sensor interfaces, dual power plus dual signal rails, or a standard UART port with power. The 0.100 inch pitch is the most common connector spacing in embedded and prototyping environments, ensuring broad mating connector availability.
How does the surface mount horizontal orientation of TSM-104-01-LM-SH-A benefit board-edge interconnect designs?
The surface mount horizontal orientation positions the mating interface parallel to the PCB surface rather than perpendicular, reducing the overall height of the assembled connector to approximately 0.28 inch above the board. This low-profile configuration is important in slim enclosures and stacked-board assemblies where vertical clearance is constrained to less than 10 mm, such as wearable device modules, compact IoT nodes, and thin industrial sensor cards.
What is the termination finish on TSM-104-01-LM-SH-A contacts, and how does it affect soldering performance?
The TSM-104-01-LM-SH-A uses a tin (Sn) over nickel (Ni) barrier termination finish on its contact tails. The nickel underlayer prevents intermetallic diffusion between copper and tin, while the tin outer layer provides good solderability during standard lead-free reflow profiles peaking at 260°C. This finish maintains reliable solder joints over the connector's service life without the oxidation-related solderability degradation seen on bare copper terminations.
When would a designer choose TSM-104-01-LM-SH-A over a through-hole terminal strip for the same 4-signal interface?
A designer would select the SMT TSM-104-01-LM-SH-A over a through-hole alternative when the PCB uses a single-sided copper layer, when automated reflow assembly eliminates a separate wave-solder step, or when the PCB thickness is less than 1.6 mm making through-hole drill registration difficult. In high-volume production, replacing through-hole connectors with SMT variants like this one reduces assembly cycle time by eliminating hand-soldering or selective wave operations for small connector counts.
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