TSM-103-04-L-DV-P SAMTEC Connector (Other) In Stock
SAMTEC TSM-103-04-L-DV-P is a 6-position dual-row surface mount terminal strip with 0.100 inch pitch and low-profile vertical orientation. Designed for SMT reflow assembly with dual-voltage contact configuration for compact PCB interfaces. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- TSM-103-04-L-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-103-04-L-DV-P?
- 6-position dual-row layout at 0.100 inch (2.54 mm) pitch for space-constrained SMT applications
- Dual-voltage (DV) contact configuration supporting differential or split-rail signal routing in a single connector
- Low-profile (L) vertical SMT body enabling board stacking and reduced overall assembly height
What is TSM-103-04-L-DV-P used for?
The TSM-103-04-L-DV-P is designed for compact surface mount PCB applications requiring a 6-pin dual-row terminal strip with 0.100 inch pitch. Its low-profile vertical form factor suits sensor modules, microcontroller breakout boards, and power distribution interfaces where minimizing board height below 5 mm is important. The dual-voltage configuration enables mixed-signal or split-rail power routing within a single 6-position connector footprint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-103-04-L-DV-P datasheet?
TSM-103-04-L-DV-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-103-04-L-DV-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact configuration of the TSM-103-04-L-DV-P and how many positions does it have?
The TSM-103-04-L-DV-P is a 6-position dual-row SMT terminal strip with 0.100 inch (2.54 mm) pitch. Its dual-voltage (DV) contact configuration allows two separate voltage rails or differential signals to be routed through a single compact connector, reducing the need for multiple connectors on space-constrained PCBs.
For what board height constraints is the low-profile TSM-103-04-L-DV-P most appropriate?
The low-profile (L) vertical SMT design of the TSM-103-04-L-DV-P keeps the installed connector height typically under 5 mm above the PCB surface. This makes it ideal for board-to-board stacking applications, wearable electronics, and compact embedded modules where overall assembly thickness must be minimized while maintaining 6-position dual-row connectivity.
How does the 0.100 inch pitch of the TSM-103-04-L-DV-P compare to finer-pitch alternatives for high-density designs?
At 0.100 inch (2.54 mm) pitch, the TSM-103-04-L-DV-P occupies more board area per contact than 0.050 inch pitch alternatives but offers easier manual soldering and higher current-per-pin ratings, typically 1 A to 3 A per contact. For 6-position interfaces where reliability and rework ease outweigh board density, the 2.54 mm pitch is generally preferred over finer-pitch 0.050 inch connectors.
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