TSM-103-04-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-103-04-L-DH-A-K-TR is a 6-position dual-row 2.54 mm pitch surface mount board connector with gold over nickel mating contacts and phosphor bronze contact material. Tape-and-reel packaging supports high-volume SMT automated assembly. Available from stock worldwide with competitive pricing and fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- TSM-103-04-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6-position dual-row board connector at 2.54 mm (0.100 inch) pitch with gold (10 µin) over nickel (50 µin) mating contact finish for low contact resistance and long mating life
- Phosphor bronze contact material provides superior spring-back and retention force through repeated mating cycles
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly in high-volume production environments
Applications
The TSM-103-04-L-DH-A-K-TR is designed for compact board-to-board and board-to-module interconnect applications in industrial controls, embedded computing, and instrumentation equipment where 6-pin dual-row signal routing is required. The gold-over-nickel mating contacts ensure reliable low-resistance connections across hundreds of mating cycles, making it suitable for removable daughter cards and mezzanine modules. Its tape-and-reel form factor facilitates seamless integration into automated SMT production lines.
Specifications
| YTEOL | 9.1 |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Rated Current (Signal) | 7A |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 6 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating does the TSM-103-04-L-DH-A-K-TR use, and how does it affect mating cycle life?
The TSM-103-04-L-DH-A-K-TR uses gold (10 µin) over nickel (50 µin) mating contact finish on phosphor bronze contacts. Gold plating provides low and stable contact resistance, typically below 20 mΩ, and supports hundreds to thousands of mating cycles without significant oxidation or resistance increase, making it ideal for frequently disconnected module or daughter-card connectors.
How many positions does the TSM-103-04-L-DH-A-K-TR have, and what pitch does it use?
The TSM-103-04-L-DH-A-K-TR is a 6-position dual-row connector using the standard 2.54 mm (0.100 inch) pitch. This standard pitch is widely used across SAMTEC's TSM series and is compatible with common 0.100-inch pitch receptacles, breadboards, and development board connectors, simplifying sourcing and design compatibility.
What JESD-609 code does the TSM-103-04-L-DH-A-K-TR carry, and what does this mean for soldering?
The TSM-103-04-L-DH-A-K-TR carries JESD-609 code e3, indicating that it is a moisture sensitivity level 3 (MSL 3) rated SMD component. This means the component must be stored in dry-pack conditions and baked or reflowed within 168 hours of opening the moisture barrier bag to avoid delamination or solder joint defects during the SMT reflow process.
When would the TSM-103-04-L-DH-A-K-TR be preferred over a through-hole equivalent terminal strip?
The TSM-103-04-L-DH-A-K-TR surface mount variant is preferred when the PCB design uses a single-side SMT assembly process, eliminating the cost of wave soldering or hand soldering associated with through-hole connectors. The 6-position 2.54 mm pitch SMD footprint also supports higher board density, and the tape-and-reel packaging cuts component handling time in automated assembly lines producing hundreds or thousands of boards per run.
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