TSM-103-03-H-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-103-03-H-DH-A-K-TR is a 6-position, 0.100" pitch surface mount terminal strip with dual-row headers for reliable PCB-to-PCB connections. Features high-current capacity, robust 2.54 mm contact spacing, and RoHS-compliant construction for modern designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- TSM-103-03-H-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-103-03-H-DH-A-K-TR?
- 6-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch for compact PCB layouts
- High-current rated contacts ensure reliable power and signal distribution across industrial and consumer applications
- RoHS-compliant construction with gold-plated contacts for superior corrosion resistance and solderability
What is TSM-103-03-H-DH-A-K-TR used for?
The TSM-103-03-H-DH-A-K-TR is ideal for board-to-board interconnections in industrial control systems, test and measurement equipment, and embedded computing platforms. Its surface mount configuration suits compact PCB designs where reliable 0.100-inch pitch connections are required, and it is well suited for prototyping, telecommunications hardware, and embedded module stacking applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-103-03-H-DH-A-K-TR datasheet?
TSM-103-03-H-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-103-03-H-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and number of positions of the TSM-103-03-H-DH-A-K-TR terminal strip?
The TSM-103-03-H-DH-A-K-TR is a 6-position terminal strip with a 0.100 inch (2.54 mm) pitch. This dual-row surface mount configuration provides 6 contacts arranged for compact and reliable PCB connections in space-constrained designs.
Which PCB design scenarios benefit most from using the TSM-103-03-H-DH-A-K-TR over through-hole alternatives?
Surface mount designs requiring lower-profile interconnects at 2.54 mm pitch benefit most. The TSM-103-03-H-DH-A-K-TR's SMT footprint reduces board thickness by eliminating through-hole drilling, enabling finer PCB routing under the connector and supporting automated pick-and-place assembly for 6-pin dual-row configurations.
How does the TSM-103-03-H-DH-A-K-TR compare to through-hole Samtec TSW series in terms of mounting and board space?
Unlike through-hole TSW series connectors that require drilled holes, the TSM-103-03-H-DH-A-K-TR uses SMT pads, reducing PCB thickness and enabling denser layouts. With 6 positions at 0.100 inch pitch, it occupies a footprint of approximately 7.62 mm in row length, saving vertical board clearance compared to standard DIP-style connectors.
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