TSM-103-01-L-SH SAMTEC Connector (Other) In Stock
SAMTEC TSM-103-01-L-SH is a 3-position single-row board connector with 2.54 mm pitch, gold-over-nickel contacts, and peg board mounting, measuring 0.30 × 0.28 × 0.12 inches body. RoHS-compliant, 1-week lead time. From $1.50 in stock, worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 3
- Lifecycle
- ACTIVE
- Datasheet
- TSM-103-01-L-SH Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Gold (10 µin) over nickel (50 µin) contact finish ensures reliable low-resistance mating in 3-position signal and power connections
- Peg board mounting option provides positive PCB alignment and strain relief during assembly and operation
- Pre-assembled contact design with 2.54 mm pitch fits standard 0.1-inch grid PCB layouts for easy prototyping and production
Applications
The TSM-103-01-L-SH is used for low-pin-count board-to-board and wire-to-board connections in test and measurement equipment, development boards, and industrial control modules where 3 signal positions at 2.54 mm pitch are sufficient. Its gold-plated contacts provide reliable mating in low-current signal interfaces such as I2C, UART, and power supply connections on embedded computing platforms. The connector is also popular in laboratory instruments, robotics, and prototyping environments where 1-week delivery and standard 0.1-inch grid compatibility simplify rapid iteration.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 9.1 |
| Board Mounting Option | PEG |
| Body Breadth | 0.12inch |
| Body Depth | 0.28inch |
| Body Length | 0.3inch |
| Connector Type | BOARD CONNECTOR |
| Contact Design | PREASSEM CONN |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 1 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | CSA; UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 3 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does TSM-103-01-L-SH use, and how does it affect long-term connection reliability?
TSM-103-01-L-SH uses gold (10 µin) plated over nickel (50 µin) contacts. Gold plating at 10 µin provides excellent corrosion resistance and maintains low contact resistance even after hundreds of mating cycles, which is important for signal integrity in low-voltage interfaces operating below 3.3 V. The nickel underplating (50 µin) acts as a diffusion barrier, preventing base metal migration into the gold layer and extending the connector's operational life in environments with humidity or mild chemical exposure.
How does TSM-103-01-L-SH's peg mounting option simplify PCB assembly compared to standard through-hole connectors?
The peg board mounting feature on TSM-103-01-L-SH provides a positive mechanical fixture that holds the connector in place on the PCB before soldering, eliminating the need for fixtures or tape during wave solder or hand soldering operations. This is particularly valuable in low-volume assembly and prototyping environments where connectors at 2.54 mm pitch must be placed precisely without drift during reflow. The peg also adds mechanical strain relief, reducing stress on solder joints when cables are repeatedly connected and disconnected to the 3-position header.
For a 3-position signal interface on a development board, when would TSM-103-01-L-SH be chosen over a screw terminal block?
TSM-103-01-L-SH is preferred over a screw terminal block when the 3-position interface must be mated and unmated repeatedly with a matching crimp or pin housing without tools. Screw terminals accept bare wire ends and suit permanent or infrequent connections, but they cannot mate with pre-assembled connector housings at 2.54 mm pitch. TSM-103-01-L-SH accepts standard 2.54 mm pitch pin headers and socket connectors, making it the correct choice for development boards and test fixtures where a modular, tool-free 3-pin interface with gold contacts is needed.
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