TSM-102-05-TL-DV-P SAMTEC Connector (Other) In Stock
SAMTEC TSM-102-05-TL-DV-P is a 4-position dual-row surface-mount terminal strip on 2.54 mm (0.100 inch) pitch, featuring top-loaded contact access and pin-in-paste solder termination for reliable PCB signal breakout and test point connections.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- TSM-102-05-TL-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-102-05-TL-DV-P?
- 4-position dual-row layout provides 8 total contacts in a compact 2.54 mm pitch footprint
- Top-load (TL) design allows vertical pin access for probing or wire termination after PCB assembly
- Surface-mount pin-in-paste termination enables standard automated reflow assembly
- Dual-row configuration maximizes connection density in minimal board area
- 2.54 mm pitch compatible with standard jumper headers and ribbon cable connectors
What is TSM-102-05-TL-DV-P used for?
The TSM-102-05-TL-DV-P is used in development and prototype boards as a compact SMT terminal strip providing test point access, jumper configuration, or wire termination points for 4-position dual-row circuits. Its top-load feature allows engineers to probe or jumper individual contacts after PCB assembly without lifting the component, making it suitable for debug headers, configuration option pads, and signal breakout points on embedded system boards. The 2.54 mm pitch enables direct connection of standard 0.1-inch pitch jumper blocks and test clips used in bench evaluation and production test fixtures.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-102-05-TL-DV-P datasheet?
TSM-102-05-TL-DV-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-102-05-TL-DV-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the top-load (TL) design of the TSM-102-05-TL-DV-P allow access to individual contacts after soldering?
The top-load designation means each contact position in the TSM-102-05-TL-DV-P has an opening or recessed area accessible from the top surface of the connector body after it is soldered to the PCB. This allows a test probe, wire insertion, or jumper pin to be inserted vertically into each of the 8 contact positions without desoldering, making the connector useful as a combined SMT terminal strip and test access point in a single 2.54 mm pitch footprint.
For a microcontroller debug header using the TSM-102-05-TL-DV-P, what current and voltage ratings should engineers verify for JTAG or SWD signal levels?
SAMTEC TSM-series surface-mount terminal strips on 2.54 mm pitch are typically rated for 1 A per contact at standard ambient temperatures and working voltages up to 250 V AC, which is more than sufficient for JTAG and SWD debug signals operating at 3.3 V or 5 V with current levels below 50 mA per pin. The 4-position dual-row layout provides 8 contacts, which matches the 10-pin ARM Cortex JTAG connector standard when combined with a mating 2×5 connector, though pin mapping must be verified against the target microcontroller's debug port specification.
How does the pin-in-paste SMT termination of the TSM-102-05-TL-DV-P affect solder joint reliability compared to standard SMT pad terminations?
Pin-in-paste (PIP) termination places the component lead directly into a solder paste deposit on the PCB pad rather than soldering only the base of a flat SMT foot. During reflow, the solder wicks up around the pin, creating a fillet with approximately 2 to 3 times greater solder joint volume than a standard SMT gull-wing or J-lead, which significantly improves mechanical pull-out strength and resistance to PCB flex and thermal cycling stress. This makes the TSM-102-05-TL-DV-P suitable for applications where the terminal strip will be subjected to repeated wire insertion and removal forces.
When is the TSM-102-05-TL-DV-P a better choice than a through-hole 2x2 pin header for a compact SMT-only PCB design?
The TSM-102-05-TL-DV-P eliminates the need for through-hole drilling on SMT-only PCBs, reducing board fabrication cost and enabling use of inner PCB layers beneath the connector footprint that would be obstructed by through-hole vias. The SMT footprint also allows placement on either side of the PCB, giving layout engineers greater flexibility. For a 4-contact dual-row header, the TSM-102-05-TL-DV-P occupies approximately 7.6 mm × 5.1 mm including the 2.54 mm pitch contact spacing, comparable to a through-hole equivalent but compatible with fully automated SMT assembly lines that lack selective soldering equipment.
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