TSM-102-05-SM-DV-P SAMTEC Connector (Other) In Stock
The SAMTEC TSM-102-05-SM-DV-P is a 4-position dual-row surface mount terminal strip with 0.100 inch (2.54 mm) pitch, straight vertical (V) mating, and friction-lock retention, designed for compact board-to-board and wire-to-board connectivity.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- TSM-102-05-SM-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-102-05-SM-DV-P?
- 4-position dual-row configuration at 0.100" (2.54 mm) industry-standard pitch
- Straight vertical (V) mating orientation for direct perpendicular board engagement
- Surface mount (SM) termination compatible with standard SMT reflow soldering
- Friction-lock retention mechanism for secure connector mating without additional hardware
- Tin-plated contacts providing reliable solderability and consistent electrical performance
What is TSM-102-05-SM-DV-P used for?
The TSM-102-05-SM-DV-P is used for low-position-count board-to-board interfaces in compact embedded modules, sensor breakout boards, and small industrial I/O panels where only 4 dual-row signals need to pass between PCBs. Its 0.100 inch pitch and surface mount termination make it compatible with standard PCB design rules and automated assembly equipment across consumer electronics, test fixtures, and educational development boards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-102-05-SM-DV-P datasheet?
TSM-102-05-SM-DV-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-102-05-SM-DV-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the SM termination style of TSM-102-05-SM-DV-P differ from through-hole variants?
The SM (surface mount) designation means the TSM-102-05-SM-DV-P uses solder tail pads on the PCB surface rather than through-hole pins, so it is compatible with standard SMT reflow assembly at typical solder paste temperatures of 220°C to 250°C. This eliminates the need for wave soldering or hand soldering of through-hole pins, reducing assembly cost and enabling double-sided PCB population in compact 0.100 inch pitch designs.
What is the mating interface of TSM-102-05-SM-DV-P, and which SAMTEC headers connect to it?
The TSM-102-05-SM-DV-P provides a 4-position dual-row socket interface at 0.100 inch (2.54 mm) pitch in a straight vertical orientation. It mates with standard SAMTEC TSW or TW series pin headers of the same 4-position dual-row count and 2.54 mm pitch. The 2.54 mm grid is also interchangeable with many third-party headers, giving designers broad sourcing flexibility for the mating component.
When should I choose TSM-102-05-SM-DV-P over a version with more positions for a prototype or production board?
The TSM-102-05-SM-DV-P with 4 dual-row positions at 0.100 inch pitch is ideal when the interface carries 4 or fewer bidirectional signals such as a SPI bus (MOSI, MISO, SCLK, CS) or a 4-wire UART with power. Using a 4-position strip rather than a larger 8- or 10-position alternative minimizes PCB footprint, reduces connector cost, and simplifies cable management in both prototype and low-volume production boards.
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