TSB81BA3EPFPAlternatives & Equivalent Parts
About TSB81BA3EPFP
TSB81BA3EPFP is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Other package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | TSB81BA3EPFPSource | TSB81BA3EIPFP |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Package Type | Other | Other |
| Pin Count | 80 | 80 |
| Temperature Range | ~ 70.0°C | -40.0°C ~ 85.0°C |
| Price | $4.9020 | $7.8222 |
| Electrical Parameters | ||
| YTEOL | 0 | 0 |
| Differential Output | YES | YES |
| Driver Number of Bits | 6 | 6 |
| Input Characteristics | DIFFERENTIAL | DIFFERENTIAL |
| Interface IC Type | LINE TRANSCEIVER | LINE TRANSCEIVER |
| Interface Standard | GENERAL PURPOSE | GENERAL PURPOSE |
| JESD-30 Code | S-PQFP-G80 | S-PQFP-G80 |
| JESD-609 Code | e4 | e4 |
| Number of Functions | 3 | 3 |
| Out Swing-Min | 0.172 V | 0.172 V |
| Output Characteristics | DIFFERENTIAL | DIFFERENTIAL |
| Output Low Current-Max | 0.004 A | 0.004 A |
| Output Polarity | COMPLEMENTARY | COMPLEMENTARY |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | TQFP80,.55SQ | TQFP80,.55SQ |
| Package Shape | SQUARE | SQUARE |
| Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 | 260 |
| Qualification Status | Not Qualified | Not Qualified |
| Receive Delay-Max | 7 ns | 7 ns |
| Receiver Number of Bits | 6 | 6 |
| Supply Current-Max | 150 mA | 150 mA |
| Supply Voltage-Max | 3.6 V | 3.6 V |
| Supply Voltage-Min | 3 V | 3 V |
| Supply Voltage-Nom | 3.3 V | 3.3 V |
| Supply Voltage1-Max | 3.6 V | 3.6 V |
| Supply Voltage1-Min | 3 V | 3 V |
| Supply Voltage1-Nom | 3.3 V | 3.3 V |
| Surface Mount | YES | YES |
| Technology | CMOS | CMOS |
| Temperature Grade | COMMERCIAL | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING | GULL WING |
| Terminal Pitch | 0.5 mm | 0.5 mm |
| Terminal Position | QUAD | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 | 30 |
| Transmit Delay-Max | 7 ns | 7 ns |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Quick Links
Why Look for Alternatives?
Finding alternatives for TSB81BA3EPFP is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TSB81BA3EPFP replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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Request Alternatives for TSB81BA3EPFPFAQ
What is equivalent to TSB81BA3EPFP?
Known equivalents for TSB81BA3EPFP include TSB81BA3EIPFP. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TSB81BA3EPFP?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TSB81BA3EPFP alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.