TS507CD STMicroelectronics Integrated Circuit (Small Outline Packages) In Stock
The TS507CD is a rail-to-rail operational amplifier from STMicroelectronics in an 8-pin SO package, featuring a 1.9 MHz gain-bandwidth product, 115 dB typical CMRR, and a maximum input offset voltage of 550 µV. It operates on low single-supply voltages and is designed for precision sensor interfaces, active filter stages, and battery-powered portable equipment requiring high accuracy in a compact footprint.
- Manufacturer
- STMicroelectronics
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- TS507CD Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Rail-to-rail input and output swing
- 1.9 MHz gain-bandwidth product
- 115 dB typical CMRR, 94 dB minimum
- 550 µV maximum input offset voltage
- 0.075 µA maximum bias current for high-impedance sensing
- Voltage-feedback architecture with internal frequency compensation
Applications
The TS507CD is well suited for precision sensor signal conditioning in medical and industrial equipment, where rail-to-rail swing and sub-millivolt offset allow direct interface to bridge sensors and thermocouples without additional trimming. It also serves in active low-pass and band-pass filter stages within portable audio and measurement devices that operate from single 3.3 V or 5 V supplies.
Specifications
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.075 µA |
| Bias Current-Max (IIB) @25C | 0.075 µA |
| Common-mode Reject Ratio-Min | 94dB |
| Common-mode Reject Ratio-Nom | 115dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 550 µV |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Low-Bias | NO |
| Low-Offset | YES |
| Micropower | NO |
| Number of Functions | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 0.6V/us |
| Supply Current-Max | 1.25mA |
| Supply Voltage Limit-Max | 6V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL EXTENDED |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Unity Gain BW-Nom | 1900 |
| Voltage Gain-Min | 89125.09 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the TS507CD's gain-bandwidth product affect filter design choices?
With a 1.9 MHz gain-bandwidth product, the TS507CD supports active filter designs up to several hundred kilohertz at modest closed-loop gains, making it suitable for audio band low-pass filters, anti-aliasing stages ahead of 12-bit ADCs, and sensor signal conditioning networks in portable 3.3 V or 5 V systems.
Can the TS507CD directly interface with high-impedance resistive bridge sensors?
Yes. The TS507CD's maximum bias current of 0.075 µA causes less than 7.5 µV of error across a 100 kΩ source impedance, preserving the 550 µV offset budget and allowing direct connection to Wheatstone bridge pressure sensors, thermistor dividers, and other high-impedance transducers without requiring a buffer stage.
What CMRR performance can designers expect from the TS507CD in differential measurement circuits?
The TS507CD delivers a minimum CMRR of 94 dB and a typical CMRR of 115 dB, meaning common-mode noise present on both inputs is suppressed by a factor exceeding 56,000 at low frequencies, which is critical for accurately amplifying small differential signals in the presence of 50 Hz or 60 Hz mains interference.
Which package does the TS507CD come in and how does this affect PCB layout density?
The TS507CD is housed in an 8-pin SO (SOIC-8) package with 1.27 mm pin pitch, occupying approximately 5 mm × 4 mm of board area. This small footprint allows tight placement next to sensor connectors on dense PCBs while maintaining standard soldering compatibility with automated assembly lines.
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About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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