TPS22971YZPT Texas Instruments Integrated Circuit (BGA) In Stock
TPS22971YZPT is a 3.6 V, 3 A load switch with an ultra-low 6.7 mΩ on-resistance and adjustable fast turn-on. It integrates Power Good output and Quick Output Discharge for clean power sequencing in portable electronics. Packaged in a tiny 8-ball DSBGA for space-critical mobile and IoT power rail switching.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TPS22971YZPT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Ultra-low 6.7 mΩ on-resistance minimizes conduction loss at 3 A load current for high-efficiency mobile power switching
- Adjustable fast turn-on ramp control limits inrush current during power-up of decoupling capacitor banks
- Integrated Power Good output and Quick Output Discharge enable safe power sequencing and rapid rail discharge in multi-rail SoC designs
Applications
The TPS22971YZPT is designed for mobile processors, IoT modules, and wearable electronics requiring efficient single-channel power rail switching at up to 3 A from a sub-3.6 V supply. Its 6.7 mΩ on-resistance and adjustable turn-on ramp make it ideal for camera modules, DRAM load switches, and SSD power gating where inrush control and fast enable response are critical. The 8-ball DSBGA footprint enables placement within sub-millimeter clearances on high-density multi-layer boards targeting the smallest possible power switch area.
Specifications
| Pbfree Code | Yes |
| Date Of Intro | 2017-07-19 |
| YTEOL | 15 |
| Analog IC - Other Type | Load switch |
| Input Voltage-Max | 3.6V |
| Input Voltage-Min | 0.65V |
| JESD-30 Code | R-XBGA-B8 |
| JESD-609 Code | e1 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Package Body Material | UNSPECIFIED |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 0.65V |
| Surface Mount | YES |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
| Country of Origin | Mainland China, Philippines |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TPS22971YZPT:
Texas Instruments Fixed, 1 Channel
Frequently Asked Questions
What is the on-resistance of TPS22971YZPT at 3 A and how much power does it dissipate at full load?
The TPS22971YZPT has a typical on-resistance of 6.7 mΩ, resulting in a conduction loss of only 60 mW at 3 A load current (P = I² × R = 9 × 0.0067). This extremely low dissipation allows the device to operate without heatsinking in mobile applications, maintaining high efficiency on 3.3 V and 1.8 V power rails in smartphones and IoT sensor nodes.
How does the adjustable fast turn-on feature of TPS22971YZPT prevent inrush current damage during power-up?
The TPS22971YZPT allows an external capacitor connected to the rise-time control pin to set the power-up ramp from under 100 µs to several milliseconds. Slowing the turn-on to 1 ms when powering a 100 µF bulk capacitor bank limits inrush current below 100 mA, preventing voltage droop on shared supply rails that could reset adjacent SoC cores or corrupt DRAM contents during power sequencing.
What does the Quick Output Discharge feature in TPS22971YZPT do and when is it critical in portable device designs?
Quick Output Discharge in TPS22971YZPT actively pulls the output to ground within microseconds when the switch turns off, discharging any output capacitance quickly rather than relying on load leakage. This is critical in mobile SoC power domains where re-enabling the rail within milliseconds must start from a known 0 V state to avoid logic errors—typical scenarios include camera module power cycling and NVM power gating in devices with sub-100 ms wake-from-sleep requirements.
How does TPS22971YZPT in an 8-ball DSBGA compare to TPS22970 in a larger package for space-constrained wearable designs?
The TPS22971YZPT 8-ball DSBGA measures approximately 1.1 mm × 0.9 mm, occupying under 1 mm² of PCB area, making it one of the smallest 3 A load switches available. The TPS22970 in a SOT-563 package uses roughly 4.4 mm² body area, more than 4× larger, which is a significant disadvantage on smartwatch or TWS earphone boards where every square millimeter of PCB space impacts overall product dimensions.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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