TPS2223PWPG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The TPS2223PWPG4 is a 3-channel intelligent power interface load switch IC from Texas Instruments featuring break-before-make switching. It is housed in a 24-pin HTSSOP package with a maximum power dissipation of 3.322W and is RoHS-compliant with Pb-free construction. Available in stock worldwide with fast shipping from authorized distributors.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- OBSOLETE
- Datasheet
- TPS2223PWPG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TPS2223PWPG4?
- 3-channel intelligent load switch with break-before-make switching to prevent cross-conduction
- 24-pin HTSSOP package with 3.322W power dissipation capability in a compact footprint
- RoHS-compliant Pb-free construction with plastic/epoxy body meeting JESD-609 e4 standard
What is TPS2223PWPG4 used for?
The TPS2223PWPG4 is used in systems requiring safe multiplexing of power rails, such as dual-port USB hubs, multi-source battery management circuits, and hot-swap applications. Its break-before-make feature ensures clean switching between power sources without overlap, protecting downstream loads. It is well suited for consumer electronics, industrial equipment, and portable devices that need reliable power source arbitration.
What are the specifications of TPS2223PWPG4?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Additional Feature | BREAK-BEFORE-MAKE SWITCHING |
| Adjustable Threshold | NO |
| Analog IC - Other Type | LOAD SWITCH |
| JESD-30 Code | R-PDSO-G24 |
| JESD-609 Code | e4 |
| Number of Channels | 3 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP24,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the TPS2223PWPG4 datasheet?
TPS2223PWPG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TPS2223PWPG4?
Compatible alternatives and drop-in replacements for TPS2223PWPG4:
Frequently Asked Questions
What is the TPS2223PWPG4 used for?
The TPS2223PWPG4 is a 3-channel intelligent power interface switch used for multiplexing power sources with break-before-make switching, preventing power bus overlap in applications like USB hubs and battery switching circuits.
How many channels does the TPS2223PWPG4 have?
The TPS2223PWPG4 has 3 channels in a single IC, allowing it to control three separate power paths, which reduces component count in multi-rail power switching designs.
What package is the TPS2223PWPG4 available in?
The TPS2223PWPG4 comes in a 24-pin HTSSOP (Heat-sink TSSOP) package with a maximum power dissipation of 3.322W, suitable for high-density surface-mount PCB assembly.
Is the TPS2223PWPG4 RoHS compliant?
Yes, the TPS2223PWPG4 is Pb-free and RoHS compliant, as indicated by its JESD-609 e4 code and the G4 suffix in the part number, confirming it meets environmental regulations for lead-free electronics.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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