TPS2216DBG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TPS2216DBG4 is a 3-channel intelligent power switch and load manager by Texas Instruments in a 30-pin SSOP package. Key specs: operates from 5 V and 12 V supplies, supports 3 independent channels with fault detection and current limiting. From competitive pricing, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 30
- Lifecycle
- OBSOLETE
- Datasheet
- TPS2216DBG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TPS2216DBG4?
- 3-channel independent load switch control in a single 30-pin SSOP package
- Integrated fault detection with overcurrent and thermal shutdown protection per channel
- Dual-supply operation from 5 V and 12 V rails for mixed-voltage system management
- Low on-state resistance minimizes power dissipation at full rated current
- SSOP-30 package with small 0.3 inch body width for space-efficient board layouts
What is TPS2216DBG4 used for?
TPS2216DBG4 is designed for multi-rail power management in servers, workstations, and telecom infrastructure where three independent loads must be switched and protected simultaneously. The device handles hot-swap and hot-plug events on 5 V and 12 V backplane buses, protecting downstream circuitry from inrush current and short-circuit faults. It is also suitable for industrial automation controllers and PCI or PCIe card power sequencing applications where per-channel fault isolation is critical.
What are the specifications of TPS2216DBG4?
| YTEOL | 0 |
| Additional Feature | ALSO REQUIRES 5V AND 12V SUPPLY |
| Adjustable Threshold | NO |
| Analog IC - Other Type | LOAD SWITCH |
| JESD-30 Code | R-PDSO-G30 |
| JESD-609 Code | e4 |
| Number of Channels | 3 |
| Number of Functions | 2 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SSOP30,.3 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max (Isup) | 0.12mA |
| Supply Voltage-Max (Vsup) | 5.25V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the TPS2216DBG4 datasheet?
TPS2216DBG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TPS2216DBG4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many independent power channels does TPS2216DBG4 provide, and what supply voltages are required?
The TPS2216DBG4 provides 3 independent load switch channels and requires both a 5 V and a 12 V supply for correct operation. Each channel can be independently enabled or disabled, and the device includes per-channel fault detection so a fault on one channel does not affect the other 2 channels. This makes it well suited for multi-rail server backplane and PCI card socket management.
What protection features does TPS2216DBG4 include to guard downstream components from fault conditions?
TPS2216DBG4 integrates overcurrent limiting and thermal shutdown protection on each of its 3 channels. When load current exceeds the programmed threshold or junction temperature rises above safe limits, the affected channel is turned off and a fault flag is asserted. This prevents damage to downstream ICs operating at 5 V or 12 V rails during short circuits or overload events lasting more than a few microseconds.
For a PCIe expansion slot power management design, is the SSOP-30 package of TPS2216DBG4 suitable for high-density backplanes?
Yes, the SSOP-30 package with a 0.3-inch body width gives TPS2216DBG4 a compact footprint suitable for high-density PCIe backplanes where space between slot connectors is limited to less than 15 mm. The 30-pin package integrates all three channel drivers, fault logic, and control pins without requiring external gate drivers, reducing total component count and routing complexity on multi-slot backplane PCBs.
When would TPS2216DBG4 be preferred over discrete MOSFETs for 12 V load switching in industrial systems?
TPS2216DBG4 is preferred over discrete MOSFETs when a design needs integrated current limiting, fault reporting, and 3-channel control from a single IC rather than three separate MOSFET plus driver circuits. A single TPS2216DBG4 replaces 3 P-channel MOSFETs, 3 gate drivers, and multiple passive components, reducing BOM by at least 10 parts. This integration also ensures matched switching behavior across all 3 channels, which is important in 12 V hot-swap and hot-plug applications.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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