TPA711DGNG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TPA711DGNG4 is a mono Class-AB audio power amplifier delivering 0.7 W output in an 8-pin HVSSOP package from Texas Instruments. Features 4 kHz bandwidth, 0.3% THD, and single-supply operation for headphone and speaker driving. From $0.70 in stock worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- TPA711DGNG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0.7 W mono Class-AB output power drives 8 Ω speakers or headphones directly from a single 5 V supply with only 0.3% THD
- 4 kHz audio bandwidth and low harmonic distortion deliver clear voice and notification audio in consumer handheld and portable devices
- Compact 8-pin HVSSOP exposed-pad package provides thermal efficiency for continuous audio output in slim form-factor designs
Applications
TPA711DGNG4 is used in portable consumer electronics such as handheld radios, audio notification systems, and tablet speaker drivers where a single-channel 0.7 W audio stage with low distortion is required. Its small HVSSOP package and single-supply operation make it ideal for battery-powered toys, intercom modules, and IoT voice alert devices running from 3.3 V or 5 V rails.
Specifications
| YTEOL | 0 |
| Bandwidth-Nom | 4kHz |
| Consumer IC Type | AUDIO AMPLIFIER |
| Harmonic Distortion | 0.3% |
| JESD-30 Code | S-PDSO-G8 |
| JESD-609 Code | e4 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Output Power-Nom | 0.7W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP8,.19 |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 1.25mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TPA711DGNG4:
Frequently Asked Questions
What output power and distortion does TPA711DGNG4 deliver to an 8 Ω speaker load?
TPA711DGNG4 delivers a nominal 0.7 W of continuous output power into an 8 Ω speaker with a total harmonic distortion of 0.3% at nominal supply conditions. This output level is sufficient for voice-quality audio notifications, alarms, or low-volume music playback in portable consumer devices.
Can TPA711DGNG4 drive headphones as well as speakers in a portable audio product?
Yes, TPA711DGNG4 can drive both 8 Ω speakers and headphones with 32 Ω impedance from a 5 V supply. The 0.7 W output capability and 4 kHz nominal bandwidth cover the voice frequency range for mono earpiece and headphone applications in walkie-talkies, intercoms, and portable players without requiring external driver stages.
What are the supply voltage requirements and package details for integrating TPA711DGNG4 into a compact PCB?
TPA711DGNG4 operates from a single supply voltage and is packaged in an 8-pin HVSSOP with exposed thermal pad, measuring approximately 3 mm × 3 mm. The exposed pad improves thermal dissipation during continuous 0.7 W audio output, enabling reliable operation in designs where PCB space is limited to under 10 mm² per amplifier channel.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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