TPA6139A2RGTR Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
The TPA6139A2RGTR is a DirectPath 25mW stereo headphone amplifier IC from Texas Instruments. It features two channels with 0.25 dB gain, eliminating DC-blocking capacitors for reduced BOM cost. Available in a 16-pin QFN package with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 17
- Lifecycle
- ACTIVE
- Datasheet
- TPA6139A2RGTR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 150.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- DirectPath architecture eliminates DC-blocking capacitors, reducing BOM cost and PCB size
- 25mW output power per channel with ultra-low noise and distortion for high-fidelity audio
- Dual-channel (stereo) Class AB amplifier design in compact 16-pin QFN package
Applications
The TPA6139A2RGTR is ideal for portable audio devices such as smartphones, tablets, and MP3 players requiring high-quality headphone output. Its DirectPath technology makes it suitable for cost-sensitive consumer electronics where eliminating bulky DC-blocking capacitors saves space and reduces component count. It is also used in handheld gaming devices and portable media players demanding low power consumption and excellent audio fidelity.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Consumer IC Type | CLASS AB AUDIO AMPLIFIER |
| Gain | 0.25dB |
| JESD-30 Code | S-PQCC-N16 |
| JESD-609 Code | e4 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Output Power-Nom | 0.025W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC16,.12SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Surface Mount | YES |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
| Country of Origin | Philippines |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the output power of the TPA6139A2RGTR?
The TPA6139A2RGTR delivers a nominal output power of 25mW per channel (0.025 W), making it well-suited for driving standard 32-ohm headphones with clear, distortion-free audio in portable applications.
What package does the TPA6139A2RGTR use and how many pins does it have?
The TPA6139A2RGTR comes in a 16-pin QFN (Quad Flat No-Lead) package, which provides a compact PCB footprint with good thermal performance, ideal for space-constrained portable audio designs.
What is the DirectPath feature in the TPA6139A2RGTR?
DirectPath is Texas Instruments' proprietary output coupling architecture that removes the need for external DC-blocking capacitors at the headphone output. This reduces total BOM cost, board space, and eliminates the low-frequency roll-off associated with traditional capacitor-coupled amplifiers.
Is the TPA6139A2RGTR RoHS compliant?
Yes, the TPA6139A2RGTR is RoHS compliant and lead-free, as indicated by its JESD-609 Code e4 and Pbfree Code Yes, meeting modern environmental regulations for electronic components.
What are typical applications for the TPA6139A2RGTR?
This amplifier is commonly used in smartphones, tablets, portable media players, handheld gaming consoles, and other consumer electronics requiring high-quality stereo headphone output with minimal external components and low power consumption.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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