TPA6112A2DGQG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TPA6112A2DGQG4 is a 10 pins integrated circuit by Texas Instruments. Key specs: 10 pins, Small Outline Packages package, MSOP-10. From quote-based sourcing, in stock checks support worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 10
- Lifecycle
- OBSOLETE
- Datasheet
- TPA6112A2DGQG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TPA6112A2DGQG4?
- 10 pins Integrated Circuit option from Texas Instruments
- Small Outline Packages package supports production sourcing and assembly review
- API context notes MSOP-10
- Suitable for industrial electronics, embedded systems, maintenance repairs, and production BOM sourcing
What is TPA6112A2DGQG4 used for?
TPA6112A2DGQG4 is used in industrial electronics, embedded systems, maintenance repairs, and production BOM sourcing where buyers need a sourced integrated circuit from Texas Instruments. It is suited for production BOM review, repair sourcing, and engineering validation when 10 pins and package compatibility are confirmed.
What are the specifications of TPA6112A2DGQG4?
| YTEOL | 0 |
| Bandwidth-Nom | 20kHz |
| Consumer IC Type | AUDIO AMPLIFIER |
| Gain | 10dB |
| Harmonic Distortion | 0.1% |
| JESD-30 Code | S-PDSO-G10 |
| JESD-609 Code | e4 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Output Power-Nom | 0.15W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP10,.19,20 |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 3mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TPA6112A2DGQG4 datasheet?
TPA6112A2DGQG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TPA6112A2DGQG4?
Compatible alternatives and drop-in replacements for TPA6112A2DGQG4:
Frequently Asked Questions
How should audio engineers assess TPA6112A2DGQG4 channel needs?
Confirm that the design requires 2 channels and that source level, load, gain, noise, and coupling choices fit the documented amplifier behavior.
Which frequency requirement matters when qualifying TPA6112A2DGQG4?
The intended audio path should remain within the documented 20 kHz nominal bandwidth while meeting system distortion, filtering, and gain objectives.
For PCB layout, what must be checked for TPA6112A2DGQG4?
Use the official Texas Instruments MSOP footprint for all 10 pins, with short decoupling and careful separation of input and output routing.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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