TPA6112A2DGQG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TPA6112A2DGQG4 is a 10 pins integrated circuit by Texas Instruments. Key specs: 10 pins, Small Outline Packages package, MSOP-10. From quote-based sourcing, in stock checks support worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 10
- Lifecycle
- OBSOLETE
- Datasheet
- TPA6112A2DGQG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10 pins Integrated Circuit option from Texas Instruments
- Small Outline Packages package supports production sourcing and assembly review
- API context notes MSOP-10
- Suitable for industrial electronics, embedded systems, maintenance repairs, and production BOM sourcing
Applications
TPA6112A2DGQG4 is used in industrial electronics, embedded systems, maintenance repairs, and production BOM sourcing where buyers need a sourced integrated circuit from Texas Instruments. It is suited for production BOM review, repair sourcing, and engineering validation when 10 pins and package compatibility are confirmed.
Specifications
| YTEOL | 0 |
| Bandwidth-Nom | 20kHz |
| Consumer IC Type | AUDIO AMPLIFIER |
| Gain | 10dB |
| Harmonic Distortion | 0.1% |
| JESD-30 Code | S-PDSO-G10 |
| JESD-609 Code | e4 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Output Power-Nom | 0.15W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP10,.19,20 |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 3mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TPA6112A2DGQG4:
Frequently Asked Questions
Which designs are a good fit for TPA6112A2DGQG4?
TPA6112A2DGQG4 fits industrial electronics, embedded systems, maintenance repairs, and production BOM sourcing that need 10 pins, using Texas Instruments sourcing data and the recorded Integrated Circuit classification for production BOM review.
How should engineers evaluate this Texas Instruments part before layout release?
Engineers should confirm 10 pins, Small Outline Packages package, and the current datasheet revision before layout release because suffix or packaging changes can affect assembly assumptions.
What sourcing checks matter before approving TPA6112A2DGQG4 for production?
Procurement teams should verify 10 pins, lifecycle status, requested packaging, and supplier traceability before committing inventory for worldwide shipping or scheduled production builds.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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