TPA0102PWPG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
Texas Instruments TPA0102PWPG4 is a 2-channel headphone audio amplifier delivering 1.5 W nominal output power with 1% THD across a 20 kHz bandwidth. It operates from 5 V or 3.3 V supply in a 24-pin HTSSOP package. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- OBSOLETE
- Datasheet
- TPA0102PWPG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TPA0102PWPG4?
- 2-channel headphone amplifier with 1.5 W per channel output power and 1% THD supporting 20 kHz full audio bandwidth
- Dual-supply compatibility: operates at either 5 V or 3.3 V supply rails for flexible portable device integration
- 24-pin HTSSOP package enabling compact stereo headphone amplifier PCB designs in consumer audio and media player applications
What is TPA0102PWPG4 used for?
The TPA0102PWPG4 drives stereo headphone outputs in portable media players, smartphones, and tablet audio subsystems where 1.5 W per channel and 20 kHz audio bandwidth are required. Its ability to operate from both 5 V and 3.3 V supplies simplifies integration alongside USB-powered or battery-powered audio circuits. The low 1% total harmonic distortion ensures clean audio reproduction for consumer-grade headphone listening applications.
What are the specifications of TPA0102PWPG4?
| YTEOL | 0 |
| Additional Feature | CAN ALSO OPERATE AT 3.3V SUPPLY |
| Bandwidth-Nom | 20kHz |
| Consumer IC Type | AUDIO AMPLIFIER |
| Harmonic Distortion | 1% |
| JESD-30 Code | R-PDSO-G24 |
| JESD-609 Code | e4 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Output Power-Nom | 1.5W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP24,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 25mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TPA0102PWPG4 datasheet?
TPA0102PWPG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TPA0102PWPG4?
Compatible alternatives and drop-in replacements for TPA0102PWPG4:
Frequently Asked Questions
What is the output power and audio bandwidth of TPA0102PWPG4 per channel?
The TPA0102PWPG4 delivers 1.5 W nominal output power per channel at 1% total harmonic distortion, across a 20 kHz audio bandwidth. This 2-channel configuration provides sufficient drive for 32 Ω headphones or small speakers in portable media players and tablets operating from a 5 V supply.
Can TPA0102PWPG4 operate from a 3.3 V supply and what design flexibility does this offer?
Yes, the TPA0102PWPG4 can operate at both 5 V and 3.3 V supply voltages, allowing it to be powered directly from a USB 3.3 V LDO rail or the main 5 V bus without requiring a separate supply regulator. This dual-voltage compatibility simplifies headphone amplifier circuit design in mobile devices where multiple supply rails are already present on the PCB.
How does the HTSSOP-24 package of TPA0102PWPG4 compare to a DIP package for audio amplifier PCB layout?
The 24-pin HTSSOP package of TPA0102PWPG4 uses an exposed thermal pad and a much smaller PCB footprint than an equivalent DIP package, enabling closer placement to audio connectors and shorter signal traces that reduce noise pickup. At 1.5 W per channel output and 20 kHz bandwidth, the HTSSOP thermal pad helps dissipate heat without needing a bulky through-hole heatsink assembly.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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