TMS570LS3137CGWTMEP Texas Instruments Integrated Circuit (BGA) In Stock
The TMS570LS3137CGWTMEP is a 32-bit ARM Cortex-R4F safety microcontroller from Texas Instruments clocked up to 80 MHz with dual ADC and DMA. It features a 22-bit address bus, 16-channel ADC2, and BGA packaging for automotive and industrial safety-critical designs. Available from stock worldwide for demanding functional safety applications.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 337
- Lifecycle
- OBSOLETE
- Datasheet
- TMS570LS3137CGWTMEP Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-bit ARM Cortex-R4F core at up to 80 MHz with lockstep dual-core safety architecture for IEC 61508 and ISO 26262 compliance
- Dual ADC with up to 16 channels (ADC2) and DMA support enable high-throughput, deterministic analog signal acquisition for motor control and sensing
- BGA package with 22-bit address bus and 16-bit external data bus supports large external memory and peripheral expansion in safety-critical embedded systems
Applications
The TMS570LS3137CGWTMEP is engineered for safety-critical automotive and industrial applications including electric power steering, antilock braking systems, transmission control, and industrial motor drives that require IEC 61508 or ISO 26262 functional safety compliance. Its 32-bit ARM Cortex-R4F lockstep dual-core architecture provides built-in CPU self-test and error detection essential for achieving SIL 3 or ASIL D safety integrity levels. Dual ADC channels and DMA controllers also suit it for real-time control of three-phase motor drives, resolver-based position sensing, and high-speed data acquisition systems.
Specifications
| Pbfree Code | No |
| YTEOL | 0 |
| Has ADC | YES |
| Additional Feature | IT ALSO HAVING ADC2 WITH 16 CHANNEL |
| Address Bus Width | 22 |
| Bit Size | 32 |
| Clock Frequency-Max | 80MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| External Data Bus Width | 16 |
| JESD-30 Code | S-PBGA-B337 |
| Number of I/O Lines | 16 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| RAM (bytes) | 262144 |
| ROM (words) | 3145728 |
| ROM Programmability | FLASH |
| Speed | 180MHz |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.14V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Form | BALL |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.25 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TMS570LS3137CGWTMEP:
suggested
suggested
Frequently Asked Questions
What processor core and maximum clock speed does the TMS570LS3137CGWTMEP use?
The TMS570LS3137CGWTMEP is built around a 32-bit ARM Cortex-R4F processor core running at up to 80 MHz. The Cortex-R4F includes a hardware floating-point unit and lockstep dual-core execution for functional safety, making it ideal for deterministic real-time control in automotive and industrial applications.
Does the TMS570LS3137CGWTMEP have analog-to-digital conversion capability?
Yes, the TMS570LS3137CGWTMEP integrates two ADC modules, including ADC2 with 16 channels. This dual-ADC architecture allows simultaneous analog signal acquisition from multiple sensors, supporting applications like three-phase motor current sensing, temperature monitoring, and position feedback in real-time control systems.
What safety standards is the TMS570LS3137CGWTMEP designed to support?
The TMS570LS3137CGWTMEP is designed for IEC 61508 SIL 3 and ISO 26262 ASIL D functional safety applications. Its lockstep dual-core CPU, on-chip self-test facilities (LBIST/PBIST), and error-correcting code (ECC) memory contribute to meeting the stringent diagnostic coverage requirements of these safety standards.
What package does the TMS570LS3137CGWTMEP use, and is it lead-free?
The TMS570LS3137CGWTMEP is packaged in a BGA (Ball Grid Array) which provides the high pin count and compact footprint needed for a full-featured 32-bit microcontroller. Note that this particular variant has a Pb-free code of No, indicating it uses a non-lead-free (SnPb) solder ball composition typical for certain automotive-qualified components.
What are typical applications for the TMS570LS3137CGWTMEP?
Typical applications include automotive electric power steering (EPS), antilock braking systems (ABS), transmission control units, industrial servo and motor drives, and safety-critical embedded controllers in rail and aerospace systems. The 'MEP' suffix also indicates enhanced qualification for military, aviation, or space-related environments requiring extended reliability and temperature testing.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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