TMS320VC5410AZWS16Alternatives & Equivalent Parts

About TMS320VC5410AZWS16

TMS320VC5410AZWS16 is a Integrated Circuit component manufactured by Texas Instruments. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	TMS320VC5410AZWS16Source	TMS320VC5410AZWS12	TMS320VC5409AZWS16	TMS320VC5410AZGU16	TMS320VC5410AGWS12	TMS320VC5409AZWS12	TMS320VC5409AGWS16	TMS320VC5410AGGU16	TMS320VC5402AZGU16	TMS320VC5409AZGU16
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package Type	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	144	144	144	144	144	144	144	144	144	144
Temperature Range	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C	-40.0°C ~ 100.0°C
Price	$29.8300	$26.3200	$24.2400	$39.4250	$28.5700	$21.8500	$24.2400	$16.5300	—	—
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	ACTIVE	ACTIVE	OBSOLETE	ACTIVE	ACTIVE	ACTIVE	OBSOLETE	OBSOLETE	OBSOLETE
Electrical Parameters
Pbfree Code	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Date Of Intro	2020-05-23	2020-05-23	2020-05-23	—	2020-05-23	2020-05-23	2020-05-23	—	—	—
YTEOL	15	15	15	0	15	15	15	0	0	0
Address Bus Width	23	23	23	23	23	23	23	23	23	23
Barrel Shifter	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Bit Size	16	16	16	16	16	16	16	16	16	16
Boundary Scan	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Clock Frequency-Max	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
External Data Bus Width	16	16	16	16	16	16	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated Cache	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Internal Bus Architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 Code	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144
JESD-609 Code	e1	e1	e1	e1	e0	e1	e0	e0	e1	e1
Low Power Mode	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Number of DMA Channels	6	6	6	6	6	6	6	6	6	6
Number of External Interrupts	4	4	4	4	4	4	4	4	4	4
Number of Timers	1	1	1	1	1	1	1	1	2	1
On Chip Data RAM Width	16	16	16	16	16	16	16	16	16	16
On Chip Program ROM Width	16	16	16	16	16	16	16	16	16	16
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	BGA144(UNSPEC)
Package Shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	260	260	260	220	260	220	220	260	260
RAM (words)	65536	65536	32768	65536	65536	32768	32768	65536	16384	32768
ROM Programmability	MROM	MROM	MROM	MROM	MROM	MROM	MROM	MROM	MROM	MROM
Supply Voltage-Max	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
Supply Voltage-Min	1.55 V	1.42 V	1.55 V	1.55 V	1.42 V	1.42 V	1.55 V	1.55 V	1.55 V	1.55 V
Supply Voltage-Nom	1.6 V	1.5 V	1.6 V	1.6 V	1.5 V	1.5 V	1.6 V	1.6 V	1.6 V	1.6 V
Surface Mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30	30	30	20	30	20	20	30	30
uPs/uCs/Peripheral ICs Type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Additional Feature	—	—	—	ALSO REQUIRES 3.3V SUPPLY	—	—	—	ALSO REQUIRES 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Qualification Status	—	—	—	Not Qualified	—	—	—	Not Qualified	Not Qualified	Not Qualified
Screening Level	—	—	—	—	—	—	—	—	TS 16949	—
Supply Current-Max	—	—	—	—	—	—	—	—	0.8 mA	—

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.