TMS320DM357ZWT Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments TMS320DM357ZWT is a 32-bit fixed-point Digital Media System-on-Chip featuring Ethernet, I2C, SPI, UART, and USB interfaces in a 361-ball BGA package. Supports multimedia processing with 3.3 V I/O supply compatibility. Available in RoHS-compliant packaging with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 361
- Lifecycle
- ACTIVE
- Datasheet
- TMS320DM357ZWT Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $22.9700(MOQ 8)
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-bit fixed-point DSP core optimized for digital media processing applications
- Multi-protocol connectivity: Ethernet, I2C, SPI, UART, and USB all on one chip
- Compact 19x19 mm 361-ball BGA package enabling high-density board designs
Applications
The TMS320DM357ZWT is designed for digital media and video processing systems, making it ideal for embedded video surveillance cameras, media players, and industrial imaging devices. Its integrated Ethernet and USB interfaces enable networked media appliances and industrial communication gateways. The 32-bit fixed-point architecture efficiently handles codec processing, image scaling, and real-time multimedia pipeline workloads.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | ALSO REQUIRES 3.3 V I/O SUPPLY |
| Bit Size | 32 |
| Bus Compatibility | ETHERNET; I2C; SPI; UART; USB |
| Format | FIXED POINT |
| JESD-30 Code | S-PBGA-B361 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA361,19X19,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (words) | 4096 |
| Supply Voltage-Max | 1.26V |
| Supply Voltage-Min | 1.14V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.35 |
| Country of Origin | Philippines |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What core architecture does the TMS320DM357ZWT use, and what clock performance can designers expect?
The TMS320DM357ZWT uses a 32-bit fixed-point DSP core architecture. It is optimized for digital media workloads and operates with a 3.3 V I/O supply, enabling efficient processing pipelines in embedded video and imaging applications at high throughput rates.
Which communication buses are integrated into the TMS320DM357ZWT for peripheral connectivity?
The device integrates 5 communication buses: Ethernet, I2C, SPI, UART, and USB. This multi-protocol support reduces external component count and simplifies PCB routing in networked multimedia systems requiring simultaneous data transfer across multiple peripherals.
How does the 361-ball BGA package influence PCB layout for the TMS320DM357ZWT?
The 361-ball BGA package in a 19x19 mm square footprint requires careful via-in-pad or escape routing strategies. A pitch of approximately 0.8 mm between balls demands controlled-impedance traces and a minimum 4-layer PCB stack-up for reliable signal integrity at high data rates.
When would a designer choose TMS320DM357ZWT over a simpler microcontroller for a media application?
When an application demands real-time video encoding or decoding, image processing, or simultaneous Ethernet plus USB connectivity, the TMS320DM357ZWT's 32-bit fixed-point DSP engine delivers orders-of-magnitude higher throughput than a standard 8-bit or 16-bit microcontroller, justifying its 361-pin BGA integration complexity.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 8+ | $35.8900 | $287.12 |
| 500+ | $25.8400 | $12920.00 |
| 1000+ | $24.4000 | $24400.00 |
| 10000+ | $22.9700 | $229700.00 |
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