TMS320DM355DZCE270 Texas Instruments Integrated Circuit (Other) In Stock
The TMS320DM355DZCE270 is a 32-bit Digital Media System-on-Chip from Texas Instruments operating at up to 270 MHz, integrating an ARM9 core with rich peripherals including USB, UART, SPI, and I2C. It supports 1.8 V and 3.3 V I/O interfaces for flexible system integration. Available in a 337-ball BGA package with worldwide distribution.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 337
- Lifecycle
- ACTIVE
- Datasheet
- TMS320DM355DZCE270 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $26.9800(MOQ 7)
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TMS320DM355DZCE270?
- 32-bit ARM9 core running at up to 270 MHz for high-performance digital media processing
- Integrated USB, UART, SPI, and I2C interfaces for versatile connectivity in embedded systems
- Supports 1.8 V and 3.3 V I/O supply levels for compatibility with diverse system power domains
- 337-ball BGA package in a compact 19x19 mm footprint enabling dense PCB integration
What is TMS320DM355DZCE270 used for?
The TMS320DM355DZCE270 is designed for digital media applications such as IP cameras, video surveillance systems, and portable media devices requiring efficient video encode and decode. Its rich peripheral set supports industrial and consumer embedded systems that need high-speed connectivity and fixed-point DSP processing. The device is also used in medical imaging and automotive infotainment platforms where integrated multimedia processing is essential.
What are the specifications of TMS320DM355DZCE270?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O |
| Bit Size | 32 |
| Bus Compatibility | I2C; SPI; UART; USB |
| External Data Bus Width | 32 |
| Format | FIXED POINT |
| JESD-30 Code | S-PBGA-B337 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA337,19X19,25 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (words) | 8192 |
| Supply Voltage-Max | 1.365V |
| Supply Voltage-Min | 1.235V |
| Supply Voltage-Nom | 1.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.35 |
| Country of Origin | Philippines |
Where can I find the TMS320DM355DZCE270 datasheet?
TMS320DM355DZCE270 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TMS320DM355DZCE270?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What processor core and clock speed does the TMS320DM355DZCE270 use?
The TMS320DM355DZCE270 integrates a 32-bit ARM9 processor core running at up to 270 MHz in fixed-point format, providing efficient digital media processing for video and imaging applications without floating-point overhead.
What communication interfaces are available on the TMS320DM355DZCE270?
The device includes a broad set of peripherals: USB, UART, SPI, and I2C buses, along with a 32-bit external data bus, enabling connectivity with sensors, displays, storage, and host processors in complex embedded system designs.
What package does the TMS320DM355DZCE270 come in?
It comes in a 337-ball plastic BGA package measuring 19x19 mm with a 25-mil ball pitch (JESD-30 code S-PBGA-B337), suitable for high pin-count applications requiring compact board-level integration in space-constrained designs.
What supply voltages does the TMS320DM355DZCE270 support?
The TMS320DM355DZCE270 I/O operates at both 1.8 V and 3.3 V supply levels, allowing it to interface with a wide range of external components in mixed-voltage system designs without additional level-shifting hardware.
Is the TMS320DM355DZCE270 RoHS compliant?
Yes, the TMS320DM355DZCE270 is Pb-free and RoHS compliant, packaged in plastic/epoxy with a lead-free BGA construction, making it suitable for environmentally compliant manufacturing in accordance with global regulations.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 7+ | $42.1600 | $295.12 |
| 500+ | $30.3600 | $15180.00 |
| 1000+ | $28.6700 | $28670.00 |
| 10000+ | $26.9800 | $269800.00 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit