TMS320DM355DZCE270 Texas Instruments Integrated Circuit (Other) In Stock
The TMS320DM355DZCE270 is a 32-bit Digital Media System-on-Chip from Texas Instruments operating at up to 270 MHz, integrating an ARM9 core with rich peripherals including USB, UART, SPI, and I2C. It supports 1.8 V and 3.3 V I/O interfaces for flexible system integration. Available in a 337-ball BGA package with worldwide distribution.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 337
- Lifecycle
- ACTIVE
- Datasheet
- TMS320DM355DZCE270 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-bit ARM9 core running at up to 270 MHz for high-performance digital media processing
- Integrated USB, UART, SPI, and I2C interfaces for versatile connectivity in embedded systems
- Supports 1.8 V and 3.3 V I/O supply levels for compatibility with diverse system power domains
- 337-ball BGA package in a compact 19x19 mm footprint enabling dense PCB integration
Applications
The TMS320DM355DZCE270 is designed for digital media applications such as IP cameras, video surveillance systems, and portable media devices requiring efficient video encode and decode. Its rich peripheral set supports industrial and consumer embedded systems that need high-speed connectivity and fixed-point DSP processing. The device is also used in medical imaging and automotive infotainment platforms where integrated multimedia processing is essential.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O |
| Bit Size | 32 |
| Bus Compatibility | I2C; SPI; UART; USB |
| External Data Bus Width | 32 |
| Format | FIXED POINT |
| JESD-30 Code | S-PBGA-B337 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA337,19X19,25 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (words) | 8192 |
| Supply Voltage-Max | 1.365V |
| Supply Voltage-Min | 1.235V |
| Supply Voltage-Nom | 1.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.35 |
| Country of Origin | Philippines |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What processor core and clock speed does the TMS320DM355DZCE270 use?
The TMS320DM355DZCE270 integrates a 32-bit ARM9 processor core running at up to 270 MHz in fixed-point format, providing efficient digital media processing for video and imaging applications without floating-point overhead.
What communication interfaces are available on the TMS320DM355DZCE270?
The device includes a broad set of peripherals: USB, UART, SPI, and I2C buses, along with a 32-bit external data bus, enabling connectivity with sensors, displays, storage, and host processors in complex embedded system designs.
What package does the TMS320DM355DZCE270 come in?
It comes in a 337-ball plastic BGA package measuring 19x19 mm with a 25-mil ball pitch (JESD-30 code S-PBGA-B337), suitable for high pin-count applications requiring compact board-level integration in space-constrained designs.
What supply voltages does the TMS320DM355DZCE270 support?
The TMS320DM355DZCE270 I/O operates at both 1.8 V and 3.3 V supply levels, allowing it to interface with a wide range of external components in mixed-voltage system designs without additional level-shifting hardware.
Is the TMS320DM355DZCE270 RoHS compliant?
Yes, the TMS320DM355DZCE270 is Pb-free and RoHS compliant, packaged in plastic/epoxy with a lead-free BGA construction, making it suitable for environmentally compliant manufacturing in accordance with global regulations.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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