TMS320C6746BZCE3Alternatives & Equivalent Parts

About TMS320C6746BZCE3

TMS320C6746BZCE3 is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Other package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

Specification Comparison

Parameter	TMS320C6746BZCE3Source	TMS320C6746BZCEA3	TMS320C6746EZCE3	TMS320C6746BZCE4	TMS320C6746BZCED4	TMS320C6746BZWT3	TMS320C6746BZWTA3	TMS320C6746BZWT4
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package Type	Other	Other	BGA	—	Other	Other	Other	Other
Pin Count	361	361	361	—	361	361	361	361
Temperature Range	~ 90.0°C	-40.0°C ~ 105.0°C	~ 90.0°C	—	-40.0°C ~ 90.0°C	~ 90.0°C	-40.0°C ~ 105.0°C	~ 90.0°C
Price	$9.1800	—	$11.4100	—	$12.2400	—	$11.3700	$76.7448
Electrical Parameters
YTEOL	0	0	15	—	0	0	0	0
Address Bus Width	23	23	23	—	23	23	23	23
Barrel Shifter	NO	NO	NO	—	NO	NO	NO	NO
Bit Size	32	32	32	—	32	32	32	32
Boundary Scan	YES	YES	YES	—	YES	YES	YES	YES
Clock Frequency-Max	30 MHz	30 MHz	30 MHz	—	30 MHz	30 MHz	30 MHz	30 MHz
External Data Bus Width	16	16	16	—	16	16	16	16
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	—	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal Bus Architecture	SINGLE	SINGLE	SINGLE	—	SINGLE	SINGLE	SINGLE	SINGLE
JESD-30 Code	S-PBGA-B361	S-PBGA-B361	S-PBGA-B361	—	S-PBGA-B361	S-PBGA-B361	S-PBGA-B361	S-PBGA-B361
JESD-609 Code	e1	e1	e1	—	e1	e1	e1	e1
Low Power Mode	YES	YES	YES	—	YES	YES	YES	YES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	—	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA361,19X19,25	BGA361,19X19,25	—	—	BGA361,19X19,25	BGA361,19X19,32	BGA361,19X19,32	BGA361,19X19,32
Package Shape	SQUARE	SQUARE	SQUARE	—	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	—	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	260	260	—	260	260	260	260
Qualification Status	Not Qualified	Not Qualified	—	—	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (words)	8192	8192	327680	—	8192	8192	8192	8192
Screening Level	TS 16949	TS 16949	—	—	TS 16949	TS 16949	TS 16949	—
Supply Voltage-Max	1.32 V	1.32 V	1.05 V	—	1.35 V	1.32 V	1.32 V	1.35 V
Supply Voltage-Min	1.14 V	1.14 V	0.95 V	—	1.25 V	1.14 V	1.14 V	1.25 V
Supply Voltage-Nom	1.2 V	1.2 V	1 V	—	1.3 V	1.2 V	1.2 V	1.3 V
Surface Mount	YES	YES	YES	—	YES	YES	YES	YES
Technology	CMOS	CMOS	CMOS	—	CMOS	CMOS	CMOS	CMOS
Temperature Grade	OTHER	INDUSTRIAL	OTHER	—	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER	Tin/Silver/Copper (Sn/Ag/Cu)	—	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL	BALL	—	BALL	BALL	BALL	BALL
Terminal Pitch	0.65 mm	0.65 mm	0.65 mm	—	0.65 mm	0.8 mm	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM	BOTTOM	—	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30	30	—	30	30	30	30
uPs/uCs/Peripheral ICs Type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	—	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Pbfree Code	—	—	Yes	—	—	—	—	No
Additional Feature	—	—	ALSO OPEARTES AT 1.1V AND 1.2V SUPLLY	—	—	—	—	—
Integrated Cache	—	—	YES	—	—	—	—	—
Number of DMA Channels	—	—	80	—	—	—	—	—
Number of Timers	—	—	8	—	—	—	—	—
On Chip Data RAM Width	—	—	8	—	—	—	—	—

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.