TMS320C6713BZDP300 Texas Instruments Integrated Circuit (BGA) In Stock

The TMS320C6713BZDP300 is a 32-bit floating-point digital signal processor from Texas Instruments, operating at up to 300 MHz with a 22-bit address bus and integrated cache. It features boundary scan support and RoHS-compliant BGA packaging for high-performance signal processing. Available in stock with worldwide shipping at competitive pricing.

ACTIVEIntegrated CircuitVerified May 2026
Package / Visual Reference
TMS320C6713BZDP300BGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
272
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
?°C to 90.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 300 MHz maximum clock frequency delivering high-throughput floating-point DSP performance for demanding real-time signal processing tasks
  • 32-bit floating-point architecture with integrated cache enabling complex mathematical operations without external coprocessors
  • 22-bit address bus with 32-bit external data bus providing access to large memory spaces for data-intensive DSP applications

Applications

The TMS320C6713BZDP300 is designed for high-performance applications such as audio processing, telecommunications base stations, medical imaging, and software-defined radio systems that require intensive floating-point computation. Its 300 MHz clock speed and integrated cache make it effective for real-time FFT, FIR filtering, and advanced signal analysis. Industrial control and defense electronics systems also leverage this DSP for its robust architecture and reliable high-speed data throughput.

Specifications

Pbfree CodeYes
YTEOL15
Address Bus Width22
Barrel ShifterNO
Bit Size32
Boundary ScanYES
Clock Frequency-Max300MHz
External Data Bus Width32
FormatFLOATING POINT
Integrated CacheYES
Internal Bus ArchitectureMULTIPLE
JESD-30 CodeS-PBGA-B272
JESD-609 Codee1
Low Power ModeYES
Number of DMA Channels16
Number of External Interrupts4
Number of Timers2
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA272,20X20,50
Package ShapeSQUARE
Package StyleGRID ARRAY
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
RAM (words)65536
Supply Voltage-Max1.47V
Supply Voltage-Min1.33V
Supply Voltage-Nom1.4V
Surface MountYES
TechnologyCMOS
Temperature GradeOTHER
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Terminal FormBALL
Terminal Pitch1.27mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeDIGITAL SIGNAL PROCESSOR, OTHER
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCN3A991.A.2
HTS Code8542.31.00.35
Country of OriginPhilippines

Datasheet

TMS320C6713BZDP300 Datasheet Download

Official datasheet from Texas Instruments

Alternate & Equivalent Parts

Compatible alternatives and drop-in replacements for TMS320C6713BZDP300:

TMS320C6713BGDP300Texas Instruments

Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 300MHz, CMOS, PBGA272

View Part →

Frequently Asked Questions

What is the maximum operating frequency of the TMS320C6713BZDP300?

The TMS320C6713BZDP300 operates at a maximum clock frequency of 300 MHz, providing high computational throughput for floating-point DSP tasks in real-time processing applications such as audio and telecommunications systems.

What package does the TMS320C6713BZDP300 use?

The TMS320C6713BZDP300 comes in a BGA (Ball Grid Array) package, which offers a compact footprint with excellent thermal and electrical performance suited for high-density PCB designs in professional and industrial applications.

What types of applications is the TMS320C6713BZDP300 designed for?

This DSP is ideal for audio processing, software-defined radio, medical imaging, telecommunications infrastructure, and industrial control systems, where its 300 MHz floating-point performance and 32-bit architecture handle complex real-time computations efficiently.

Does the TMS320C6713BZDP300 support boundary scan testing?

Yes, the TMS320C6713BZDP300 supports boundary scan (JTAG), simplifying board-level testing and debugging. This feature is especially valuable in complex multi-chip systems where in-circuit testing of individual component connections is required.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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