TMM-110-01-S-D-SM-A SAMTEC Connector (Header, Unshrouded - Straight SMD Pin) In Stock
SAMTEC TMM-110-01-S-D-SM-A is a dual-row low-profile 2.00 mm pitch terminal strip with 10 positions per row and gold-over-nickel contact finish for reliable SMD board connections. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Header, Unshrouded - Straight SMD Pin
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TMM-110-01-S-D-SM-A Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 2.00 mm pitch dual-row terminal strip with 30 µin gold over 50 µin nickel contact finish for low-contact-resistance mating
- Low-profile SMD mounting with peg board retention enabling secure placement before reflow soldering in automated assembly
- RoHS-compliant tin-nickel termination finish compatible with standard lead-free reflow profiles up to 260°C
Applications
The TMM-110-01-S-D-SM-A is a compact dual-row 2.00 mm pitch terminal strip suited for board-to-board signal interconnection in industrial controls, medical devices, and consumer electronics where low profile and SMD assembly are required. Its gold-over-nickel contact finish ensures reliable low-resistance connections across thousands of mating cycles. The peg-mounting feature aids automated placement on high-volume production lines, making it ideal for data acquisition boards, sensor modules, and embedded system backplanes.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 3 Weeks, 1 Day |
| YTEOL | 8.4 |
| Board Mounting Option | PEG |
| Body Breadth | 0.155inch |
| Body Depth | 0.109inch |
| Body Length | 0.787inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 1050VAC V |
| Durability | 500Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Contact Row Spacing | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 4.27mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Pitch | 2mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 20 |
| UL Flammability Code | 94V-0 |
| Package | Header, Unshrouded - Straight SMD Pin |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does TMM-110-01-S-D-SM-A use and how does it affect mating reliability?
TMM-110-01-S-D-SM-A uses 30 µin gold over 50 µin nickel for the mating surface and tin with a nickel barrier on the termination side. The gold plating maintains contact resistance below 20 mΩ over 500+ mating cycles, ensuring long-term reliability in industrial and medical board interconnects.
What is the pitch and row configuration of the TMM-110-01-S-D-SM-A connector?
The TMM-110-01-S-D-SM-A has a 2.00 mm pitch in a dual-row configuration with 10 positions per row, providing 20 total contacts. Its body is 0.787 inch (20 mm) long and 0.155 inch (3.9 mm) wide, fitting compactly on PCBs in sensor interface and embedded computing designs.
How does the SMD peg-mount design of TMM-110-01-S-D-SM-A simplify PCB assembly?
The SM (surface mount) designation with a peg retention feature allows TMM-110-01-S-D-SM-A to self-locate on the board before soldering. This peg prevents shifting during pick-and-place and reflow at up to 260°C, reducing misalignment defects on production lines handling 1000+ boards per shift.
When is TMM-110-01-S-D-SM-A preferred over a 2.54 mm pitch alternative in embedded system designs?
TMM-110-01-S-D-SM-A at 2.00 mm pitch packs 20 pins into a 20 mm body length, whereas a 2.54 mm pitch 20-pin connector would need approximately 25 mm. This 20% length reduction matters for dense embedded SBC and daughtercard designs where PCB routing channels between connectors are under 5 mm wide.
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