TMM-102-01-G-S-SM SAMTEC Connector (Header, Unshrouded - Single Row Staggered SMD Pin) In Stock
SAMTEC TMM-102-01-G-S-SM is a 2-position, single-row, 2 mm pitch board-to-board surface-mount header with gold-over-nickel contacts and a staggered low-profile configuration. It suits compact SMT board interconnections where precise pitch and low stand-off height are required. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Header, Unshrouded - Single Row Staggered SMD Pin
- Pin Count
- 2
- Lifecycle
- ACTIVE
- Datasheet
- TMM-102-01-G-S-SM Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 2-position single-row surface-mount header at 2 mm pitch in a staggered low-profile configuration for space-constrained PCB designs
- Gold (20 µin) over nickel (50 µin) contact finish on both mating and termination contacts for low insertion force and long cycle life
- Compact body (0.157" L x 0.109" D x 0.078" W) enabling dense board layouts with minimal connector footprint
- Pb-free construction with 1-week factory lead time, suitable for lead-free assembly and quick-turn prototype builds
Applications
The TMM-102-01-G-S-SM is ideal for compact sensor modules, portable instrumentation, and wearable electronics requiring 2-pin board-to-board connections at a precise 2 mm pitch with minimal PCB footprint. The staggered SMT pin configuration provides mechanical stability during reflow without through-hole anchors, making it well suited for single-sided SMT assembly. It is also used in small industrial control modules where gold-contact reliability is required across hundreds of mating cycles.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8 |
| Additional Feature | LOW PROFILE, STAGGERED CONFIGURATION |
| Body Breadth | 0.078inch |
| Body Depth | 0.109inch |
| Body Length | 0.157inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (20) OVER NICKEL (50) |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | STAGGERED |
| PCB Contact Row Spacing | 2.03mm |
| Plating Thickness | 20u inch |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Pitch | 4mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 2 |
| UL Flammability Code | 94V-0 |
| Package | Header, Unshrouded - Single Row Staggered SMD Pin |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating and pitch does the TMM-102-01-G-S-SM board-to-board header use?
The TMM-102-01-G-S-SM uses gold (20 µin) over nickel (50 µin) plating on both mating and termination contacts, ensuring low and stable contact resistance across at least 100 mating cycles. The connector pitch is 2 mm in a single-row, 2-position configuration with a body length of 0.157" (approximately 4 mm), making it one of the most compact surface-mount board-to-board options at this pitch.
How does the staggered SMT configuration of TMM-102-01-G-S-SM improve soldering reliability?
The staggered pin layout distributes the 2 termination contacts at offset positions along the body, increasing the connector's resistance to lateral movement during solder reflow by widening the effective solder joint footprint. This mechanical anchoring reduces tombstoning and misalignment risk on high-speed SMT lines operating at peak reflow temperatures of 260°C, maintaining positional accuracy within ±0.1 mm after reflow.
In which ultra-compact applications is the TMM-102-01-G-S-SM preferred over a wire-to-board connector?
Board-to-board configurations eliminate wire harness routing and connector overhang, saving at least 5 mm of vertical clearance compared to wire-to-board solutions in stacked PCB assemblies. The TMM-102-01-G-S-SM's 2 mm pitch 2-position footprint is particularly suited to wearable sensor patches, medical implant sub-boards, and miniaturized IoT gateway modules where total assembly height must remain below 10 mm.
What lead time and sourcing options are available for the TMM-102-01-G-S-SM?
SAMTEC lists a standard factory lead time of 1 week for the TMM-102-01-G-S-SM, with a YTEOL indicator of 8 confirming continued active production status. The Pb-free, RoHS-compliant construction qualifies it for all major distribution channels. Authorized SAMTEC distributors typically carry stock, and the connector is available for worldwide shipping, making it accessible for both prototype quantities of 10 pieces and production volumes above 1,000 units.
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