TM4C129DNCZADI3RAlternatives & Equivalent Parts

About TM4C129DNCZADI3R

TM4C129DNCZADI3R is a Integrated Circuit component manufactured by Texas Instruments. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

Specification Comparison

Parameter	TM4C129DNCZADI3RSource	TM4C129DNCZADI3	TM4C1299NCZADI3R	TM4C129ENCZADI3R	TM4C1297NCZADI3R	TM4C1299NCZADI3	TM4C129XNCZADI3
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package Type	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	212	212	212	212	212	212	212
Temperature Range	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C
Price	$16.1000	$16.7000	—	$14.8400	—	$15.0600	$11.9329
Electrical Parameters
Pbfree Code	Yes	Yes	Yes	Yes	Yes	Yes	Yes
YTEOL	0	15	15	15	15	15	15
Has ADC	YES	YES	YES	YES	YES	YES	YES
Address Bus Width	28	28	28	28	28	28	28
Bit Size	32	32	32	32	32	32	32
Boundary Scan	YES	YES	YES	YES	YES	YES	YES
CPU Family	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F
Clock Frequency-Max	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
DAC Channels	NO	NO	NO	NO	NO	NO	NO
DMA Channels	YES	YES	YES	YES	YES	YES	YES
External Data Bus Width	32	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES	YES	YES	NO	YES	YES
JESD-30 Code	S-PBGA-B212	S-PBGA-B212	S-PBGA-B212	S-PBGA-B212	S-PBGA-B212	S-PBGA-B212	S-PBGA-B212
JESD-609 Code	e1	e1	e1	e1	e1	e1	e1
Low Power Mode	YES	YES	YES	YES	YES	YES	YES
Number of DMA Channels	32	32	32	32	32	32	32
Number of I/O Lines	140	140	140	140	140	140	140
Number of Serial I/Os	5	5	3	5	8	3	3
Number of Timers	8	8	8	8	8	8	8
On Chip Data RAM Width	8	8	8	8	8	8	8
On Chip Program ROM Width	8	8	8	8	8	8	8
PWM Channels	YES	YES	YES	YES	YES	YES	YES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	260	260	260	260	260	260
RAM (bytes)	262144	262144	262144	262144	262144	262144	262144
RAM (words)	256	256	256	256	256	256	256
ROM (words)	524288	524288	524288	524288	524288	524288	524288
ROM Programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Speed	120 MHz	120 MHz	120 MHz	120 MHz	120 MHz	120 MHz	120 MHz
Supply Current-Max	102.3 mA	102.3 mA	—	133.4 mA	64 mA	—	133.4 mA
Supply Voltage-Max	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V
Supply Voltage-Min	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Supply Voltage-Nom	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Surface Mount	YES	YES	YES	YES	YES	YES	YES
Technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal Position	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30	30	30	30	30	30
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.