TM4C123GH6PZIAlternatives & Equivalent Parts

About TM4C123GH6PZI

TM4C123GH6PZI is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Quad Flat Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

Specification Comparison

Parameter	TM4C123GH6PZISource	TM4C123GH6PZT	TM4C123GE6PZI	TM4C1231H6PZI	TM4C123BH6PZI	TM4C1233H6PZI	TM4C123GE6PZIR
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package Type	Quad Flat Packages	Quad Flat Packages	Quad Flat Packages	—	Quad Flat Packages	Quad Flat Packages	Quad Flat Packages
Pin Count	100	100	100	—	100	100	100
Temperature Range	-40.0°C ~ 85.0°C	-40.0°C ~ 105.0°C	-40.0°C ~ 85.0°C	—	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C
Price	$9.5500	$11.4400	$9.8934	$6.9600	$6.0900	—	$4.3600
Electrical Parameters
Pbfree Code	Yes	Yes	Yes	—	Yes	Yes	Yes
YTEOL	15	15	15	—	15	15	15
Has ADC	YES	YES	YES	—	YES	YES	YES
Bit Size	32	32	32	—	32	32	32
Boundary Scan	YES	YES	YES	—	—	YES	YES
CPU Family	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F	—	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F
Clock Frequency-Max	25 MHz	25 MHz	25 MHz	—	25 MHz	25 MHz	25 MHz
DAC Channels	NO	NO	NO	—	NO	NO	NO
DMA Channels	YES	YES	YES	—	YES	YES	YES
JESD-30 Code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	—	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609 Code	e4	e4	e4	—	e4	e4	e4
Number of I/O Lines	69	69	69	—	69	69	69
On Chip Data RAM Width	8	8	8	—	8	8	8
On Chip Program ROM Width	8	8	8	—	8	8	8
PWM Channels	YES	YES	YES	—	YES	YES	YES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	—	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	—	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20
Package Shape	SQUARE	SQUARE	SQUARE	—	SQUARE	SQUARE	SQUARE
Package Style	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	—	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	260	260	—	260	260	260
Qualification Status	Not Qualified	Not Qualified	Not Qualified	—	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	32768	32768	32768	—	32768	32768	32768
ROM (words)	262144	262144	65536	—	262144	262144	65536
ROM Programmability	FLASH	FLASH	FLASH	—	FLASH	FLASH	FLASH
Speed	80 MHz	80 MHz	80 MHz	—	80 MHz	80 MHz	80 MHz
Supply Voltage-Max	3.63 V	3.63 V	3.63 V	—	3.63 V	1.32 V	1.32 V
Supply Voltage-Min	3.3 V	3.3 V	3.3 V	—	3.3 V	1.2 V	1.2 V
Supply Voltage-Nom	3.3 V	3.3 V	3.3 V	—	3.3 V	1.2 V	1.2 V
Surface Mount	YES	YES	YES	—	YES	YES	YES
Technology	CMOS	CMOS	CMOS	—	CMOS	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	—	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	—	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING	GULL WING	—	GULL WING	GULL WING	GULL WING
Terminal Pitch	0.5 mm	0.5 mm	0.5 mm	—	0.5 mm	0.5 mm	0.5 mm
Terminal Position	QUAD	QUAD	QUAD	—	QUAD	QUAD	QUAD
Time@Peak Reflow Temperature-Max (s)	30	30	30	—	30	30	30
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	—	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.