TLV9102IDGKRAlternatives & Equivalent Parts
About TLV9102IDGKR
TLV9102IDGKR is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | TLV9102IDGKRSource | HCPL2530M | TL972QDRQ1 | STB55NF06T4 | CD74HC30E | LMK107BJ106MALTD |
|---|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | ON Semiconductor | Texas Instruments | STMicroelectronics | Texas Instruments | TAIYO YUDEN |
| Package Type | Small Outline Packages | Dual-In-Line Packages | Other | Other | Dual-In-Line Packages | Capacitor Chip Non-polarised |
| Pin Count | 8 | 8 | 8 | 3 | 14 | 2 |
| Temperature Range | -40.0°C ~ 125.0°C | ~ 70.0°C | -40.0°C ~ 125.0°C | ~ 175.0°C | -55.0°C ~ 125.0°C | -55.0°C ~ 85.0°C |
| Price | $0.4128 | $0.6428 | $0.0809 | $0.5064 | $0.2700 | $0.0833 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | OBSOLETE |
| Electrical Parameters | ||||||
| Pbfree Code | Yes | Yes | Yes | — | Yes | Yes |
| YTEOL | 15 | 7 | 15 | 5 | 15 | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER | — | OPERATIONAL AMPLIFIER | — | — | — |
| Architecture | VOLTAGE-FEEDBACK | — | VOLTAGE-FEEDBACK | — | — | — |
| Common-mode Reject Ratio-Min | 90 dB | — | 60 dB | — | — | — |
| Common-mode Reject Ratio-Nom | 110 dB | — | 85 dB | — | — | — |
| Frequency Compensation | YES | — | YES | — | — | — |
| Input Offset Voltage-Max | 1500 µV | — | 4000 µV | — | — | — |
| JESD-30 Code | S-PDSO-G8 | — | R-PDSO-G8 | R-PSSO-G2 | R-PDIP-T14 | — |
| JESD-609 Code | e3 | e3 | e4 | e3 | e4 | e3 |
| Low-Bias | NO | — | NO | — | — | — |
| Low-Offset | NO | — | NO | — | — | — |
| Micropower | YES | — | NO | — | — | — |
| Neg Supply Voltage Limit-Max | -10 V | — | -7.5 V | — | — | — |
| Neg Supply Voltage-Nom (Vsup) | -4 V | — | -2.5 V | — | — | — |
| Number of Functions | 2 | 2 | 2 | — | 1 | — |
| Package Body Material | PLASTIC/EPOXY | — | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | — |
| Package Equivalence Code | TSSOP8,.19 | — | SOP8,.25 | — | DIP14,.3 | — |
| Package Shape | SQUARE | — | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR PACKAGE |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | — | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMT |
| Packing Method | TR | TUBE | TR | — | TUBE | TR, PAPER, 7 INCH |
| Peak Reflow Temperature (Cel) | 260 | — | 260 | 245 | — | — |
| Power | NO | — | NO | — | — | — |
| Programmable Power | NO | — | NO | — | — | — |
| Slew Rate-Nom | 4.5 V/us | — | 5 V/us | — | — | — |
| Supply Current-Max | 0.3 mA | — | 5.6 mA | — | — | — |
| Supply Voltage Limit-Max | 10 V | — | 7.5 V | — | — | — |
| Supply Voltage-Nom (Vsup) | 4 V | — | 2.5 V | — | 4.5 V | — |
| Surface Mount | YES | NO | YES | YES | NO | YES |
| Technology | BIPOLAR | — | BIPOLAR | — | CMOS | — |
| Temperature Grade | AUTOMOTIVE | — | AUTOMOTIVE | — | MILITARY | — |
| Terminal Finish | Matte Tin (Sn) | MATTE TIN | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Form | GULL WING | — | GULL WING | GULL WING | THROUGH-HOLE | — |
| Terminal Pitch | 0.65 mm | — | 1.27 mm | — | 2.54 mm | — |
| Terminal Position | DUAL | — | DUAL | SINGLE | DUAL | — |
| Time@Peak Reflow Temperature-Max (s) | 30 | — | 30 | 30 | — | — |
| Unity Gain BW-Nom | 1100 | — | 12000 | — | — | — |
| Voltage Gain-Min | 158489 | — | 3160 | — | — | — |
| Wideband | NO | — | NO | — | — | — |
| Manufacturer Package Code | — | 646CQ | — | — | — | — |
| Additional Feature | — | TTL AND CMOS COMPATIBLE, UL APPROVED | — | — | — | — |
| Configuration | — | SEPARATE, 2 CHANNELS | — | SINGLE WITH BUILT-IN DIODE | — | — |
| Data Rate-Nom | — | 1 MBps | — | — | — | — |
| Forward Current-Max | — | 0.025 A | — | — | — | — |
| Isolation Voltage-Max | — | 5000 V | — | — | — | — |
| Mounting Feature | — | THROUGH HOLE MOUNT | — | — | — | SURFACE MOUNT |
| Number of Elements | — | 2 | — | 1 | — | — |
| On-State Current-Max | — | 0.008 A | — | — | — | — |
| Optoelectronic Device Type | — | LOGIC IC OUTPUT OPTOCOUPLER | — | — | — | — |
| Supply Voltage-Min | — | 4.5 V | — | — | — | — |
| Average Bias Current-Max (IIB) | — | — | 1 µA | — | — | — |
| Bias Current-Max (IIB) @25C | — | — | 0.75 µA | — | — | — |
| Input Offset Current-Max (IIO) | — | — | 0.15 µA | — | — | — |
| Qualification Status | — | — | Not Qualified | Not Qualified | Not Qualified | — |
| Screening Level | — | — | AEC-Q100 | — | — | — |
| Slew Rate-Min | — | — | 3.5 V/us | — | — | — |
| Factory Lead Time | — | — | — | 13 Weeks | — | 11 Weeks |
| Avalanche Energy Rating (Eas) | — | — | — | 340 mJ | — | — |
| DS Breakdown Voltage-Min | — | — | — | 60 V | — | — |
| Drain Current-Max (ID) | — | — | — | 50 A | — | — |
| Drain-source On Resistance-Max | — | — | — | 0.018 Ω | — | — |
| FET Technology | — | — | — | METAL-OXIDE SEMICONDUCTOR | — | — |
| JEDEC-95 Code | — | — | — | TO-263AB | — | — |
| Operating Mode | — | — | — | ENHANCEMENT MODE | — | — |
| Polarity/Channel Type | — | — | — | N-CHANNEL | — | — |
| Power Dissipation-Max (Abs) | — | — | — | 95 W | — | — |
| Pulsed Drain Current-Max (IDM) | — | — | — | 200 A | — | — |
| Transistor Application | — | — | — | SWITCHING | — | — |
| Transistor Element Material | — | — | — | SILICON | — | — |
| Family | — | — | — | — | HC/UH | — |
| Load Capacitance (CL) | — | — | — | — | 50 pF | — |
| Logic IC Type | — | — | — | — | NAND GATE | — |
| Max I(ol) | — | — | — | — | 0.0052 A | — |
| Number of Inputs | — | — | — | — | 8 | — |
| Power Supply Current-Max (ICC) | — | — | — | — | 0.04 mA | — |
| Prop. Delay@Nom-Sup | — | — | — | — | 39 ns | — |
| Propagation Delay (tpd) | — | — | — | — | 195 ns | — |
| Schmitt Trigger | — | — | — | — | NO | — |
| Supply Voltage-Max (Vsup) | — | — | — | — | 6 V | — |
| Supply Voltage-Min (Vsup) | — | — | — | — | 2 V | — |
| ## CD74HC30E Alternates Showing results | — | — | — | — | Image | — |
| Reach Compliance Code | — | — | — | — | — | Compliant |
| Capacitance | — | — | — | — | — | 10 µF |
| Capacitor Type | — | — | — | — | — | CERAMIC CAPACITOR |
| Dielectric Material | — | — | — | — | — | CERAMIC |
| Height | — | — | — | — | — | 0.8 mm |
| Multilayer | — | — | — | — | — | Yes |
| Negative Tolerance | — | — | — | — | — | 20% |
| Positive Tolerance | — | — | — | — | — | 20% |
| Rated (DC) Voltage (URdc) | — | — | — | — | — | 10 V |
| Size Code | — | — | — | — | — | 0603 |
| Temperature Characteristics Code | — | — | — | — | — | X5R |
| Temperature Coefficient | — | — | — | — | — | 15% ppm/°C |
| Terminal Shape | — | — | — | — | — | WRAPAROUND |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 5 alternatives for TLV9102IDGKR — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for TLV9102IDGKR is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLV9102IDGKR replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to TLV9102IDGKR?
Known equivalents for TLV9102IDGKR include HCPL2530M, TL972QDRQ1, STB55NF06T4. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLV9102IDGKR?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLV9102IDGKR alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.