TLV320AIC26IRHBRG4 Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
The TLV320AIC26IRHBRG4 is a low-power stereo audio CODEC with integrated ADC and DAC in a 32-pin VQFN package. Supports 260 °C peak reflow and is RoHS compliant. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 32
- Lifecycle
- ACTIVE
- Datasheet
- TLV320AIC26IRHBRG4 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $1.7780(MOQ 63)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TLV320AIC26IRHBRG4?
- Low-power stereo CODEC with integrated ADC and DAC reduces BOM by eliminating separate converter ICs in portable audio designs
- 32-pin very thin VQFN (S-PQCC-N32) package with heat-sink slug enables compact thermal management in space-constrained audio modules
- 260 °C peak reflow temperature compatibility ensures full lead-free assembly compliance for RoHS-regulated consumer and industrial products
- Single-function consumer audio circuit architecture simplifies driver implementation and signal chain verification in embedded audio systems
What is TLV320AIC26IRHBRG4 used for?
The TLV320AIC26IRHBRG4 is suited for portable consumer electronics and embedded voice/audio applications including Bluetooth headsets, handheld communication terminals, and low-power media players where its integrated stereo ADC and DAC minimize component count. Its very thin QFN package with heat-sink slug suits slim form-factor designs such as smart speakers and wearable audio devices where height and thermal management are constrained. Industrial HMI panels and voice-interface modules also benefit from its low power consumption and standard SPI/I2C digital audio interface.
What are the specifications of TLV320AIC26IRHBRG4?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Consumer IC Type | CONSUMER CIRCUIT |
| JESD-30 Code | S-PQCC-N32 |
| JESD-609 Code | e4 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the TLV320AIC26IRHBRG4 datasheet?
TLV320AIC26IRHBRG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TLV320AIC26IRHBRG4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What audio sample rate and bit depth does the TLV320AIC26IRHBRG4 support for voice and music recording applications?
The TLV320AIC26IRHBRG4 is a low-power stereo CODEC that supports standard audio sampling rates including 8 kHz for voice and up to 48 kHz for music, with typical 16-bit resolution in its ADC and DAC paths. This range covers narrowband voice processing at 8 kHz and wideband audio at 16 kHz, making it flexible for both telephony and multimedia embedded applications.
How does the heat-sink slug in the TLV320AIC26IRHBRG4 VQFN package affect PCB layout and thermal management?
The TLV320AIC26IRHBRG4 comes in a 32-pin very thin VQFN package with an exposed thermal slug on the bottom that should be soldered to a copper thermal pad on the PCB. Connecting the slug to a ground or thermal plane via multiple vias reduces junction-to-board thermal resistance and keeps the die within its operating temperature budget, typically targeting a case temperature below 85 °C at rated power dissipation.
What peak reflow temperature does the TLV320AIC26IRHBRG4 require, and does it meet JEDEC J-STD-020 compliance for lead-free assembly?
The TLV320AIC26IRHBRG4 is rated for a 260 °C peak reflow temperature, meeting the JEDEC J-STD-020 Class 3 profile used in lead-free SMT assembly. With the JESD-609 code e4, it confirms full RoHS compliance and halogenn-free packaging, allowing it to pass environmental certification in EU and RoHS-regulated markets without additional waivers.
For a Bluetooth headset design, what makes the TLV320AIC26IRHBRG4 a suitable CODEC choice compared to a discrete ADC plus DAC approach?
Integrating both a stereo ADC and a DAC into a single 32-pin VQFN chip, the TLV320AIC26IRHBRG4 saves approximately 2 to 4 component positions versus separate 16-bit ADC and DAC ICs, reducing both BOM cost and PCB area by up to 40 mm2. For a Bluetooth headset with a 3.6 V LiPo cell, its low-power consumer CODEC architecture avoids the idle current overhead of two discrete converters, extending battery life by extending the operational hours per charge cycle.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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| 63+ | $4.7400 | $298.62 |
| 98+ | $2.0515 | $201.05 |
| 127+ | $1.9831 | $251.85 |
| 169+ | $1.7780 | $300.48 |
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