TLV313IDCKTAlternatives & Equivalent Parts

About TLV313IDCKT

TLV313IDCKT is a Integrated Circuit component manufactured by Texas Instruments. It comes in a SOT23 (5-Pin) package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

Specification Comparison

ParameterTLV313IDCKTSourceTLV313QDCKRQ1TLV313QDCKTQ1TLV313IDCKR
ManufacturerTexas InstrumentsTexas InstrumentsTexas InstrumentsTexas Instruments
Package TypeSOT23 (5-Pin)SOT23 (5-Pin)SOT23 (5-Pin)SOT23 (5-Pin)
Pin Count5555
Temperature Range-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C
Price$0.5670$0.2316$0.6820$0.0611
Electrical Parameters
Pbfree CodeYesYesYesYes
Date Of Intro2016-06-182017-11-172017-11-172016-06-18
YTEOL15151515
Amplifier TypeOPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACKVOLTAGE-FEEDBACKVOLTAGE-FEEDBACKVOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min70 dB70 dB70 dB64 dB
Common-mode Reject Ratio-Nom85 dB85 dB85 dB85 dB
Frequency CompensationYESYESYESYES
Input Offset Voltage-Max3000 µV3000 µV3000 µV3000 µV
JESD-30 CodeR-PDSO-G5R-PDSO-G5R-PDSO-G5R-PDSO-G5
JESD-609 Codee3e4e4e3
Low-BiasNOYESYESNO
Low-OffsetNONONONO
MicropowerYESYESYESNO
Number of Functions1111
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package ShapeRECTANGULARRECTANGULARRECTANGULARRECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing MethodTRTRTRTR, 7 INCH
Peak Reflow Temperature (Cel)260260260260
PowerNONONONO
Programmable PowerNONONONO
Slew Rate-Nom0.5 V/us0.5 V/us0.5 V/us0.5 V/us
Supply Current-Max0.09 mA0.09 mA0.09 mA0.09 mA
Supply Voltage Limit-Max7 V7 V7 V7 V
Supply Voltage-Nom (Vsup)5 V5 V5 V5 V
Surface MountYESYESYESYES
TechnologyCMOSCMOSCMOSCMOS
Temperature GradeAUTOMOTIVEAUTOMOTIVEAUTOMOTIVEAUTOMOTIVE
Terminal FinishTin (Sn)Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)Tin (Sn)
Terminal FormGULL WINGGULL WINGGULL WINGGULL WING
Terminal Pitch0.65 mm0.65 mm0.65 mm0.65 mm
Terminal PositionDUALDUALDUALDUAL
Time@Peak Reflow Temperature-Max (s)30303030
Unity Gain BW-Nom1000100010001000
Voltage Gain-Min100000100000100000100000
WidebandNONONONO
Screening LevelAEC-Q100AEC-Q100
Package Equivalence CodeTSSOP5/6,.08

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

Quick Links

TLV313QDCKRQ1by Texas Instruments Operational

Amplifier, 1 Func, 3000uV Offset-Max, CMOS, PDSO5

TLV313QDCKTQ1by Texas Instruments Operational

Amplifier, 1 Func, 3000uV Offset-Max, CMOS, PDSO5

TLV313IDCKRby Texas Instruments Operational

Amplifier, 1 Func, 3000uV Offset-Max, CMOS, PDSO5

Why Look for Alternatives?

Finding alternatives for TLV313IDCKT is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating TLV313IDCKT replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to TLV313IDCKT?

Known equivalents for TLV313IDCKT include TLV313QDCKRQ1, TLV313QDCKTQ1, TLV313IDCKR. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of TLV313IDCKT?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify TLV313IDCKT alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.