TLV2772AMJGBAlternatives & Equivalent Parts
About TLV2772AMJGB
TLV2772AMJGB is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Ceramic Dual-In-Line Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | TLV2772AMJGBSource | TLV2772AIP |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Package Type | Ceramic Dual-In-Line Packages | Dual-In-Line Packages |
| Pin Count | 8 | 8 |
| Temperature Range | -55.0°C ~ 125.0°C | -40.0°C ~ 125.0°C |
| Price | $52.4400 | $2.3625 |
| Electrical Parameters | ||
| Pbfree Code | Yes | Yes |
| YTEOL | 15 | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.00035 µA | 0.00035 µA |
| Bias Current-Max (IIB) @25C | 0.00006 µA | 0.00006 µA |
| Common-mode Reject Ratio-Min | 60 dB | 60 dB |
| Common-mode Reject Ratio-Nom | 96 dB | 96 dB |
| Frequency Compensation | YES | YES |
| Input Offset Current-Max (IIO) | 0.00006 µA | 0.00006 µA |
| Input Offset Voltage-Max | 1600 µV | 1600 µV |
| JESD-30 Code | R-CDIP-T8 | R-PDIP-T8 |
| JESD-609 Code | e0 | e4 |
| Low-Bias | YES | YES |
| Low-Offset | NO | NO |
| Micropower | NO | NO |
| Number of Functions | 2 | 2 |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| Package Equivalence Code | DIP8,.3 | DIP8,.3 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | IN-LINE | IN-LINE |
| Packing Method | TUBE | TUBE |
| Power | NO | NO |
| Programmable Power | NO | NO |
| Qualification Status | Not Qualified | Not Qualified |
| Screening Level | MIL-STD-883 | — |
| Slew Rate-Min | 4.7 V/us | 4.7 V/us |
| Slew Rate-Nom | 10.5 V/us | 10.5 V/us |
| Subcategory | Operational Amplifier | Operational Amplifier |
| Supply Current-Max | 4 mA | 4 mA |
| Supply Voltage Limit-Max | 7 V | 7 V |
| Supply Voltage-Nom (Vsup) | 2.7 V | 2.7 V |
| Surface Mount | NO | NO |
| Technology | CMOS | CMOS |
| Temperature Grade | MILITARY | AUTOMOTIVE |
| Terminal Finish | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm | 2.54 mm |
| Terminal Position | DUAL | DUAL |
| Unity Gain BW-Nom | 5100 | 5100 |
| Voltage Gain-Min | 13000 | 13000 |
| Wideband | NO | NO |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Quick Links
Why Look for Alternatives?
Finding alternatives for TLV2772AMJGB is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLV2772AMJGB replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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Request Alternatives for TLV2772AMJGBFAQ
What is equivalent to TLV2772AMJGB?
Known equivalents for TLV2772AMJGB include TLV2772AIP. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLV2772AMJGB?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLV2772AMJGB alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.