TLV272IDGKG4In StockTexas Instruments
Family of 550 µA/Channel 3 MHz rail-to-rail output Operational Amplifiers 8 mA,2.7 V,16 V -40°C ~ 125°C (TA)
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- TLV272IDGKG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Specifications
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.00006 µA |
| Bias Current-Max (IIB) @25C | 0.00006 µA |
| Common-mode Reject Ratio-Min | 65dB |
| Common-mode Reject Ratio-Nom | 80dB |
| Frequency Compensation | YES |
| Input Offset Current-Max (IIO) | 0.00006 µA |
| Input Offset Voltage-Max | 5000 µV |
| JESD-30 Code | S-PDSO-G8 |
| JESD-609 Code | e4 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | NO |
| Neg Supply Voltage Limit-Max | -8.25 V |
| Neg Supply Voltage-Nom (Vsup) | -5 V |
| Number of Functions | 2 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP8,.19 |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Min | 1V/us |
| Slew Rate-Nom | 2.1V/us |
| Subcategory | Operational Amplifier |
| Supply Current-Max | 1.32mA |
| Supply Voltage Limit-Max | 8.25V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Unity Gain BW-Nom | 3000 |
| Voltage Gain-Min | 70795 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
| Country of Origin | Mainland China, Malaysia, Mexico, Philippines, Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TLV272IDGKG4:
Frequently Asked Questions
What is the price of TLV272IDGKG4?
TLV272IDGKG4 is priced from competitive USD depending on quantity. Submit an RFQ on FindMyChip for the best current pricing from authorized China distributors.
Is TLV272IDGKG4 in stock?
TLV272IDGKG4 is currently available at FindMyChip. We maintain stock from authorized distributors and ship worldwide with typical 3-7 business day lead time.
Where can I buy TLV272IDGKG4?
You can buy TLV272IDGKG4 from FindMyChip, a B2B electronic component platform sourcing from China distributors. We offer competitive pricing and low MOQ for TLV272IDGKG4 from Texas Instruments.
What is the datasheet for TLV272IDGKG4?
The official TLV272IDGKG4 datasheet from Texas Instruments contains full specifications including pin configuration, electrical characteristics, and application notes. Download it directly from the datasheet section above.
What package does TLV272IDGKG4 come in?
TLV272IDGKG4 is available in Small Outline Packages packaging. See the package diagram and pinout above for detailed dimensional information.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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