TLV2463QPWRG4Q1 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

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OBSOLETEIntegrated CircuitVerified Jul 2026
Package / Visual Reference
TLV2463QPWRG4Q1Small Outline Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Small Outline Packages
Pin Count
14
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TLV2463QPWRG4Q1?

  • Integrated Circuit from Texas Instruments identified by manufacturer part number TLV2463QPWRG4Q1
  • Documented technical context includes 0 A for engineering comparison
  • Package or mechanical reference recorded as Small Outline Packages for footprint checks
  • Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
  • Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval

What is TLV2463QPWRG4Q1 used for?

TLV2463QPWRG4Q1 is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 0 A.

What are the specifications of TLV2463QPWRG4Q1?

Pbfree CodeYes
YTEOL0
Amplifier TypeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)0.014 µA
Bias Current-Max (IIB) @25C0.014 µA
Common-mode Reject Ratio-Min71dB
Common-mode Reject Ratio-Nom85dB
Frequency CompensationYES
Input Offset Current-Max (IIO)0.007 µA
Input Offset Voltage-Max2000 µV
JESD-30 CodeR-PDSO-G14
JESD-609 Codee4
Low-BiasNO
Low-OffsetNO
MicropowerNO
Number of Functions2
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeTSSOP14,.25
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing MethodTR
Peak Reflow Temperature (Cel)260
PowerNO
Programmable PowerNO
Qualification StatusNot Qualified
Screening LevelAEC-Q100
Slew Rate-Min0.8V/us
Slew Rate-Nom1.6V/us
Supply Current-Max1.3mA
Supply Voltage Limit-Max6V
Supply Voltage-Nom (Vsup)3V
Surface MountYES
TechnologyCMOS
Temperature GradeAUTOMOTIVE
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormGULL WING
Terminal Pitch0.65mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)30
Unity Gain BW-Nom6400
Voltage Gain-Min31622
WidebandNO
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
ECCNEAR99
HTS Code8542.33.00.01

Where can I find the TLV2463QPWRG4Q1 datasheet?

TLV2463QPWRG4Q1 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for TLV2463QPWRG4Q1?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which design checks should buyers confirm before selecting TLV2463QPWRG4Q1?

Buyers should verify the integrated circuit role, package fit, lifecycle status, and datasheet ratings before approving this part. The fetched technical context includes 0 A, which should be matched against the target circuit and sourcing documentation.

How does the recorded package information affect sourcing TLV2463QPWRG4Q1?

The recorded package reference is Small Outline Packages, so purchasers should confirm footprint compatibility, assembly handling, and approved manufacturer documentation. Include 0 A in the engineering review so procurement does not substitute a part with mismatched limits.

When comparing alternates for TLV2463QPWRG4Q1, which parameters matter most?

Start with manufacturer, component category, package style, lifecycle status, and the electrical or mechanical ratings shown in the datasheet. Because the available context includes 0 A, any alternate should match that requirement before release.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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