TLV2462AMJGBAlternatives & Equivalent Parts
About TLV2462AMJGB
TLV2462AMJGB is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Ceramic Dual-In-Line Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | TLV2462AMJGBSource | TLV2462AIDRG4 |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Package Type | Ceramic Dual-In-Line Packages | Small Outline Packages |
| Pin Count | 8 | 8 |
| Temperature Range | -55.0°C ~ 125.0°C | -40.0°C ~ 125.0°C |
| Price | $49.8500 | $1.7122 |
| Electrical Parameters | ||
| Pbfree Code | Yes | — |
| YTEOL | 15 | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.075 µA | 0.075 µA |
| Bias Current-Max (IIB) @25C | 0.014 µA | 0.014 µA |
| Common-mode Reject Ratio-Min | 71 dB | 71 dB |
| Common-mode Reject Ratio-Nom | 85 dB | 80 dB |
| Frequency Compensation | YES | YES |
| Input Offset Current-Max (IIO) | 0.007 µA | 0.007 µA |
| Input Offset Voltage-Max | 1500 µV | 1700 µV |
| JESD-30 Code | R-GDIP-T8 | R-PDSO-G8 |
| JESD-609 Code | e0 | e4 |
| Low-Bias | NO | NO |
| Low-Offset | NO | NO |
| Micropower | NO | NO |
| Number of Functions | 2 | 2 |
| Package Body Material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| Package Equivalence Code | DIP8,.3 | SOP8,.25 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | IN-LINE | SMALL OUTLINE |
| Packing Method | TUBE | TR |
| Power | NO | NO |
| Programmable Power | NO | NO |
| Qualification Status | Not Qualified | Not Qualified |
| Slew Rate-Min | 0.8 V/us | 0.8 V/us |
| Slew Rate-Nom | 1.6 V/us | 1.6 V/us |
| Subcategory | Operational Amplifier | — |
| Supply Current-Max | 1.3 mA | 1.3 mA |
| Supply Voltage Limit-Max | 6 V | 6 V |
| Supply Voltage-Nom (Vsup) | 3 V | 3 V |
| Surface Mount | NO | YES |
| Technology | CMOS | CMOS |
| Temperature Grade | MILITARY | AUTOMOTIVE |
| Terminal Finish | Tin/Lead (Sn/Pb) | NICKEL PALLADIUM GOLD |
| Terminal Form | THROUGH-HOLE | GULL WING |
| Terminal Pitch | 2.54 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL |
| Unity Gain BW-Nom | 6400 | 5200 |
| Voltage Gain-Min | 31622 | 31622 |
| Wideband | NO | NO |
| Peak Reflow Temperature (Cel) | — | 260 |
| Time@Peak Reflow Temperature-Max (s) | — | 30 |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Quick Links
Why Look for Alternatives?
Finding alternatives for TLV2462AMJGB is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLV2462AMJGB replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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Request Alternatives for TLV2462AMJGBFAQ
What is equivalent to TLV2462AMJGB?
Known equivalents for TLV2462AMJGB include TLV2462AIDRG4. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLV2462AMJGB?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLV2462AMJGB alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.