TLV2462AIDRG4Alternatives & Equivalent Parts
About TLV2462AIDRG4
TLV2462AIDRG4 is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | TLV2462AIDRG4Source | TLV2462AMJGB |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Package Type | Small Outline Packages | Ceramic Dual-In-Line Packages |
| Pin Count | 8 | 8 |
| Temperature Range | -40.0°C ~ 125.0°C | -55.0°C ~ 125.0°C |
| Price | $1.7122 | $49.8500 |
| Electrical Parameters | ||
| YTEOL | 0 | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.075 µA | 0.075 µA |
| Bias Current-Max (IIB) @25C | 0.014 µA | 0.014 µA |
| Common-mode Reject Ratio-Min | 71 dB | 71 dB |
| Common-mode Reject Ratio-Nom | 80 dB | 85 dB |
| Frequency Compensation | YES | YES |
| Input Offset Current-Max (IIO) | 0.007 µA | 0.007 µA |
| Input Offset Voltage-Max | 1700 µV | 1500 µV |
| JESD-30 Code | R-PDSO-G8 | R-GDIP-T8 |
| JESD-609 Code | e4 | e0 |
| Low-Bias | NO | NO |
| Low-Offset | NO | NO |
| Micropower | NO | NO |
| Number of Functions | 2 | 2 |
| Package Body Material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | SOP8,.25 | DIP8,.3 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE | IN-LINE |
| Packing Method | TR | TUBE |
| Peak Reflow Temperature (Cel) | 260 | — |
| Power | NO | NO |
| Programmable Power | NO | NO |
| Qualification Status | Not Qualified | Not Qualified |
| Slew Rate-Min | 0.8 V/us | 0.8 V/us |
| Slew Rate-Nom | 1.6 V/us | 1.6 V/us |
| Supply Current-Max | 1.3 mA | 1.3 mA |
| Supply Voltage Limit-Max | 6 V | 6 V |
| Supply Voltage-Nom (Vsup) | 3 V | 3 V |
| Surface Mount | YES | NO |
| Technology | CMOS | CMOS |
| Temperature Grade | AUTOMOTIVE | MILITARY |
| Terminal Finish | NICKEL PALLADIUM GOLD | Tin/Lead (Sn/Pb) |
| Terminal Form | GULL WING | THROUGH-HOLE |
| Terminal Pitch | 1.27 mm | 2.54 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | — |
| Unity Gain BW-Nom | 5200 | 6400 |
| Voltage Gain-Min | 31622 | 31622 |
| Wideband | NO | NO |
| Pbfree Code | — | Yes |
| Subcategory | — | Operational Amplifier |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Quick Links
Why Look for Alternatives?
Finding alternatives for TLV2462AIDRG4 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLV2462AIDRG4 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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Request Alternatives for TLV2462AIDRG4FAQ
What is equivalent to TLV2462AIDRG4?
Known equivalents for TLV2462AIDRG4 include TLV2462AMJGB. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLV2462AIDRG4?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLV2462AIDRG4 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.