TLV2372IDAlternatives & Equivalent Parts
About TLV2372ID
TLV2372ID is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | TLV2372IDSource | TLV2372IDRG4 | TLV2372IDGK | TLV2372IDG4 | TLV2372IDGKR | TLV2372IDGKG4 | TLV2372IDGKRG4 |
|---|---|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package Type | Small Outline Packages | Small Outline Packages | — | Small Outline Packages | — | Small Outline Packages | Small Outline Packages |
| Pin Count | 8 | 8 | — | 8 | — | 8 | 8 |
| Temperature Range | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | — | -40.0°C ~ 125.0°C | — | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C |
| Price | $0.1775 | $0.1900 | $0.7642 | $0.1775 | $0.5400 | $1.1911 | $0.7344 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | OBSOLETE | — | OBSOLETE | — | OBSOLETE | OBSOLETE |
| Electrical Parameters | |||||||
| Pbfree Code | Yes | — | — | — | — | — | Yes |
| YTEOL | 15 | 0 | — | 0 | — | 0 | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | — | OPERATIONAL AMPLIFIER | — | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | — | VOLTAGE-FEEDBACK | — | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.00006 µA | 0.00006 µA | — | 0.00006 µA | — | 0.00006 µA | 0.00006 µA |
| Bias Current-Max (IIB) @25C | 0.00006 µA | 0.00006 µA | — | 0.00006 µA | — | 0.00006 µA | 0.00006 µA |
| Common-mode Reject Ratio-Min | 55 dB | 55 dB | — | 55 dB | — | 55 dB | 55 dB |
| Common-mode Reject Ratio-Nom | 72 dB | 72 dB | — | 72 dB | — | 72 dB | 72 dB |
| Frequency Compensation | YES | YES | — | YES | — | YES | YES |
| Input Offset Current-Max (IIO) | 0.00006 µA | 0.00006 µA | — | — | — | 0.00006 µA | 0.00006 µA |
| Input Offset Voltage-Max | 4500 µV | 4500 µV | — | 6000 µV | — | 4500 µV | 4500 µV |
| JESD-30 Code | R-PDSO-G8 | R-PDSO-G8 | — | R-PDSO-G8 | — | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609 Code | e4 | e4 | — | e4 | — | e4 | e4 |
| Low-Bias | YES | YES | — | YES | — | YES | YES |
| Low-Offset | NO | NO | — | NO | — | NO | NO |
| Micropower | NO | NO | — | NO | — | NO | NO |
| Number of Functions | 2 | 2 | — | 2 | — | 2 | 2 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | — | PLASTIC/EPOXY | — | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 | SOP8,.25 | — | SOP8,.25 | — | TSSOP8,.19 | TSSOP8,.19 |
| Package Shape | RECTANGULAR | RECTANGULAR | — | RECTANGULAR | — | SQUARE | SQUARE |
| Package Style | SMALL OUTLINE | SMALL OUTLINE | — | SMALL OUTLINE | — | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE | TR | — | TUBE | — | TUBE | TR |
| Peak Reflow Temperature (Cel) | 260 | 260 | — | 260 | — | 260 | 260 |
| Power | NO | NO | — | NO | — | NO | NO |
| Programmable Power | NO | NO | — | NO | — | NO | NO |
| Qualification Status | Not Qualified | Not Qualified | — | Not Qualified | — | Not Qualified | Not Qualified |
| Slew Rate-Min | 1 V/us | 1 V/us | — | 1 V/us | — | 1 V/us | 1 V/us |
| Slew Rate-Nom | 2.4 V/us | 2.4 V/us | — | 2.4 V/us | — | 2.4 V/us | 2.4 V/us |
| Subcategory | Operational Amplifier | Operational Amplifier | — | — | — | Operational Amplifier | Operational Amplifier |
| Supply Current-Max | 1.32 mA | 1.32 mA | — | 0.0024 mA | — | 1.32 mA | 1.32 mA |
| Supply Voltage Limit-Max | 16.5 V | 16.5 V | — | 16.5 V | — | 16.5 V | 16.5 V |
| Supply Voltage-Nom (Vsup) | 5 V | 5 V | — | 5 V | — | 5 V | 5 V |
| Surface Mount | YES | YES | — | YES | — | YES | YES |
| Technology | CMOS | CMOS | — | CMOS | — | CMOS | CMOS |
| Temperature Grade | AUTOMOTIVE | AUTOMOTIVE | — | AUTOMOTIVE | — | AUTOMOTIVE | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | — | NICKEL PALLADIUM GOLD | — | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| Terminal Form | GULL WING | GULL WING | — | GULL WING | — | GULL WING | GULL WING |
| Terminal Pitch | 1.27 mm | 1.27 mm | — | 1.27 mm | — | 0.65 mm | 0.65 mm |
| Terminal Position | DUAL | DUAL | — | DUAL | — | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | NOT SPECIFIED | — | 30 | — | NOT SPECIFIED | NOT SPECIFIED |
| Unity Gain BW-Nom | 3000 | 3000 | — | 3000 | — | 3000 | 3000 |
| Voltage Gain-Min | 79432 | 79432 | — | 6300 | — | 79432 | 79432 |
| Wideband | YES | YES | — | NO | — | YES | YES |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 6 alternatives for TLV2372ID — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for TLV2372ID is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLV2372ID replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to TLV2372ID?
Known equivalents for TLV2372ID include TLV2372IDRG4, TLV2372IDGK, TLV2372IDG4. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLV2372ID?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLV2372ID alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.