TLV2316QDGKRQ1Alternatives & Equivalent Parts
About TLV2316QDGKRQ1
TLV2316QDGKRQ1 is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | TLV2316QDGKRQ1Source | TLV2316IDGKR | TLV2316QDGKTQ1 |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments |
| Package Type | Small Outline Packages | — | Small Outline Packages |
| Pin Count | 8 | — | 8 |
| Temperature Range | -40.0°C ~ 125.0°C | — | -40.0°C ~ 125.0°C |
| Price | $0.6563 | $0.4741 | $0.9880 |
| Electrical Parameters | |||
| Pbfree Code | Yes | — | Yes |
| Date Of Intro | 2016-12-25 | — | 2016-12-25 |
| YTEOL | 15 | — | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER | — | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | — | VOLTAGE-FEEDBACK |
| Common-mode Reject Ratio-Min | 72 dB | — | 72 dB |
| Common-mode Reject Ratio-Nom | 90 dB | — | 90 dB |
| Frequency Compensation | YES | — | YES |
| Input Offset Voltage-Max | 3000 µV | — | 3000 µV |
| JESD-30 Code | S-PDSO-G8 | — | S-PDSO-G8 |
| JESD-609 Code | e4 | — | e4 |
| Low-Bias | NO | — | NO |
| Low-Offset | NO | — | NO |
| Micropower | NO | — | NO |
| Number of Functions | 2 | — | 2 |
| Package Body Material | PLASTIC/EPOXY | — | PLASTIC/EPOXY |
| Package Shape | SQUARE | — | SQUARE |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | — | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR | — | TR |
| Peak Reflow Temperature (Cel) | 260 | — | 260 |
| Power | NO | — | NO |
| Programmable Power | NO | — | NO |
| Screening Level | AEC-Q100 | — | AEC-Q100 |
| Slew Rate-Nom | 6 V/us | — | 6 V/us |
| Supply Current-Max | 1150 mA | — | 1150 mA |
| Supply Voltage Limit-Max | 7 V | — | 7 V |
| Supply Voltage-Nom (Vsup) | 5 V | — | 5 V |
| Surface Mount | YES | — | YES |
| Technology | CMOS | — | CMOS |
| Temperature Grade | AUTOMOTIVE | — | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | — | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING | — | GULL WING |
| Terminal Pitch | 0.65 mm | — | 0.65 mm |
| Terminal Position | DUAL | — | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | — | 30 |
| Unity Gain BW-Nom | 10000 | — | 10000 |
| Voltage Gain-Min | 100000 | — | 100000 |
| Wideband | NO | — | NO |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Quick Links
Why Look for Alternatives?
Finding alternatives for TLV2316QDGKRQ1 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLV2316QDGKRQ1 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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What is equivalent to TLV2316QDGKRQ1?
Known equivalents for TLV2316QDGKRQ1 include TLV2316IDGKR, TLV2316QDGKTQ1. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLV2316QDGKRQ1?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLV2316QDGKRQ1 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.