TLV2264AMJB Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
The TLV2264AMJB is a quad low-power CMOS operational amplifier from Texas Instruments with an ultra-low input bias current of 0.06 pA and a common-mode rejection ratio of 83 dB typical. Key specs: rail-to-rail output, 70 dB minimum CMRR, ceramic DIP-14 package. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- TLV2264AMJB Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TLV2264AMJB?
- Ultra-low input bias current of 0.06 pA at 25 °C enables accurate signal amplification with high-impedance sensors such as pH electrodes and photodiodes without introducing significant input error
- 83 dB typical common-mode rejection ratio (CMRR) with 70 dB minimum ensures excellent rejection of power-supply noise and common-mode interference in differential measurement circuits
- Ceramic dual-in-line package rated for extended military temperature ranges, providing long-term hermeticity and reliability in aerospace, defense, and harsh-environment instrumentation applications
What is TLV2264AMJB used for?
The TLV2264AMJB is used in precision instrumentation amplifiers, medical-grade signal conditioning circuits, and chemical sensor interfaces where the sub-picoamp input bias current prevents loading of high-impedance sources such as ion-selective electrodes and MEMS microphones. Its quad configuration with 83 dB CMRR makes it suitable for differential ECG and EEG bio-signal acquisition front-ends requiring low noise and high common-mode rejection. The hermetic ceramic DIP package also serves aerospace data acquisition systems and military avionics where long-term moisture resistance and reliability under vibration are mandatory.
What are the specifications of TLV2264AMJB?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.0008 µA |
| Bias Current-Max (IIB) @25C | 0.00006 µA |
| Common-mode Reject Ratio-Min | 70dB |
| Common-mode Reject Ratio-Nom | 83dB |
| Frequency Compensation | YES |
| Input Offset Current-Max (IIO) | 0.00006 µA |
| Input Offset Voltage-Max | 950 µV |
| JESD-30 Code | R-GDIP-T14 |
| JESD-609 Code | e0 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 4 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | FL14,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 |
| Slew Rate-Min | 0.25V/us |
| Slew Rate-Nom | 0.55V/us |
| Subcategory | Operational Amplifier |
| Supply Current-Max | 1mA |
| Supply Voltage Limit-Max | 16V |
| Supply Voltage-Nom (Vsup) | 3V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Unity Gain BW-Nom | 710 |
| Voltage Gain-Min | 25000 |
| Wideband | NO |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TLV2264AMJB datasheet?
TLV2264AMJB Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TLV2264AMJB?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the input bias current of the TLV2264AMJB, and which sensor types does this enable?
The TLV2264AMJB has a maximum input bias current of 0.8 pA average and a typical bias current of only 0.06 pA at 25 °C. This extremely low value allows the op-amp to interface directly with pH electrodes, ion-selective sensors, and photodiodes with internal impedances above 1 GΩ without introducing more than a few microvolts of error from the bias current flowing through the source impedance.
How does the TLV2264AMJB's 83 dB CMRR benefit differential bio-signal acquisition circuits?
With a typical CMRR of 83 dB and a minimum of 70 dB, the TLV2264AMJB attenuates 50 Hz or 60 Hz mains interference — which appears as common-mode noise on ECG or EEG electrode pairs — by a factor of more than 3000:1. This allows millivolt-level cardiac signals to be extracted cleanly without additional active notch filtering, reducing circuit complexity in 3-electrode to 12-lead biopotential measurement systems.
When is the ceramic DIP package of TLV2264AMJB preferred over plastic SOIC versions of quad op-amps?
The hermetic ceramic DIP package of TLV2264AMJB is preferred in military avionics, satellite instrument payloads, and oil-well logging tools where plastic packages would absorb moisture and degrade performance over thousands of hours at -55 °C to +125 °C. The ceramic hermetic seal passes MIL-STD-883 leak test, maintaining stable input offset voltage below 1 mV and input bias current below 1 pA across the full operating temperature range — criteria that disqualify commercial plastic SOIC variants.
How many op-amp channels does the TLV2264AMJB contain, and what does this mean for board density in multichannel designs?
The TLV2264AMJB is a quad op-amp providing 4 independent amplifier channels in a single 14-pin DIP package. For a 16-channel differential instrumentation system, only 4 TLV2264AMJB devices are needed for the input buffer stage, compared to 16 single-channel or 8 dual-channel op-amps. This reduces PCB area by approximately 50%, simplifies power decoupling, and lowers procurement complexity without sacrificing the 0.06 pA bias current or 83 dB CMRR performance.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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