TLV2262AMJGB Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
Texas Instruments TLV2262AMJGB is a dual rail-to-rail operational amplifier with 70 dB min CMRR and 0.8 nA max bias current in a ceramic DIP package. It features voltage-feedback architecture with frequency compensation for stable single-supply operation. Available from stock worldwide with competitive pricing.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TLV2262AMJGB Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual rail-to-rail input and output op-amp with 70 dB minimum common-mode rejection ratio for precision signal conditioning
- Ultra-low 0.8 nA maximum input bias current enabling high-impedance sensor interfaces with minimal loading
- Ceramic DIP package with MIL-grade reliability ratings for harsh-environment and space-qualified applications
Applications
The TLV2262AMJGB is designed for precision signal conditioning in military, aerospace, and high-reliability industrial applications where ceramic packaging and wide temperature range performance are mandatory. Its rail-to-rail output swing and low bias current make it suitable for instrumentation amplifiers, active filters, and sensor front-ends operating from a single 2.7 V to 8 V supply in harsh environments.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.0008 µA |
| Bias Current-Max (IIB) @25C | 0.00006 µA |
| Common-mode Reject Ratio-Min | 70dB |
| Common-mode Reject Ratio-Nom | 83dB |
| Frequency Compensation | YES |
| Input Offset Current-Max (IIO) | 0.00006 µA |
| Input Offset Voltage-Max | 950 µV |
| JESD-30 Code | R-GDIP-T8 |
| JESD-609 Code | e0 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 2 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP8,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 |
| Slew Rate-Min | 0.25V/us |
| Slew Rate-Nom | 0.55V/us |
| Subcategory | Operational Amplifier |
| Supply Current-Max | 0.5mA |
| Supply Voltage Limit-Max | 16V |
| Supply Voltage-Nom (Vsup) | 3V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Unity Gain BW-Nom | 710 |
| Voltage Gain-Min | 25000 |
| Wideband | NO |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the common-mode rejection ratio of the TLV2262AMJGB and why does it matter in sensor applications?
The TLV2262AMJGB specifies a minimum CMRR of 70 dB and typical 83 dB. This level of common-mode rejection attenuates 50 Hz or 60 Hz interference by over 10,000:1, which is critical in bridge-sensor and thermocouple amplifier circuits where noise can corrupt small differential signals below 1 mV.
What makes the ceramic DIP package of TLV2262AMJGB suitable for harsh environments compared to plastic packages?
Ceramic DIP packages offer hermetic sealing that prevents moisture ingress, enabling operation across a -55°C to +125°C temperature range and meeting MIL-STD-883 screening requirements. Plastic PDIP packages absorb moisture and fail faster under thermal cycling, making ceramic essential for aerospace and defense systems.
How does the TLV2262AMJGB dual-channel configuration help reduce component count in a 4-channel data acquisition front-end?
Two TLV2262AMJGB devices provide 4 independent op-amp channels, halving the IC count and PCB footprint compared to four single op-amps. With 0.8 nA max bias current per channel, all 4 inputs can be connected directly to 10 MΩ sensor sources without introducing more than 8 µV of offset error.
For a precision 16-bit data acquisition system, how does TLV2262AMJGB's offset voltage performance compare to general-purpose op-amps?
The TLV2262AMJGB offers input offset current as low as 0.06 pA and CMRR of 83 dB typical, which are required to keep total system error below 1 LSB at 16-bit resolution with a 5 V full-scale range—corresponding to a threshold of approximately 76 µV per bit.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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