TLV2262AMJGB Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
Texas Instruments TLV2262AMJGB is a dual rail-to-rail operational amplifier with 70 dB min CMRR and 0.8 nA max bias current in a ceramic DIP package. It features voltage-feedback architecture with frequency compensation for stable single-supply operation. Available from stock worldwide with competitive pricing.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TLV2262AMJGB Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TLV2262AMJGB?
- Dual rail-to-rail input and output op-amp with 70 dB minimum common-mode rejection ratio for precision signal conditioning
- Ultra-low 0.8 nA maximum input bias current enabling high-impedance sensor interfaces with minimal loading
- Ceramic DIP package with MIL-grade reliability ratings for harsh-environment and space-qualified applications
What is TLV2262AMJGB used for?
The TLV2262AMJGB is designed for precision signal conditioning in military, aerospace, and high-reliability industrial applications where ceramic packaging and wide temperature range performance are mandatory. Its rail-to-rail output swing and low bias current make it suitable for instrumentation amplifiers, active filters, and sensor front-ends operating from a single 2.7 V to 8 V supply in harsh environments.
What are the specifications of TLV2262AMJGB?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.0008 µA |
| Bias Current-Max (IIB) @25C | 0.00006 µA |
| Common-mode Reject Ratio-Min | 70dB |
| Common-mode Reject Ratio-Nom | 83dB |
| Frequency Compensation | YES |
| Input Offset Current-Max (IIO) | 0.00006 µA |
| Input Offset Voltage-Max | 950 µV |
| JESD-30 Code | R-GDIP-T8 |
| JESD-609 Code | e0 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 2 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP8,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 |
| Slew Rate-Min | 0.25V/us |
| Slew Rate-Nom | 0.55V/us |
| Subcategory | Operational Amplifier |
| Supply Current-Max | 0.5mA |
| Supply Voltage Limit-Max | 16V |
| Supply Voltage-Nom (Vsup) | 3V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Unity Gain BW-Nom | 710 |
| Voltage Gain-Min | 25000 |
| Wideband | NO |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TLV2262AMJGB datasheet?
TLV2262AMJGB Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TLV2262AMJGB?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the common-mode rejection ratio of the TLV2262AMJGB and why does it matter in sensor applications?
The TLV2262AMJGB specifies a minimum CMRR of 70 dB and typical 83 dB. This level of common-mode rejection attenuates 50 Hz or 60 Hz interference by over 10,000:1, which is critical in bridge-sensor and thermocouple amplifier circuits where noise can corrupt small differential signals below 1 mV.
What makes the ceramic DIP package of TLV2262AMJGB suitable for harsh environments compared to plastic packages?
Ceramic DIP packages offer hermetic sealing that prevents moisture ingress, enabling operation across a -55°C to +125°C temperature range and meeting MIL-STD-883 screening requirements. Plastic PDIP packages absorb moisture and fail faster under thermal cycling, making ceramic essential for aerospace and defense systems.
How does the TLV2262AMJGB dual-channel configuration help reduce component count in a 4-channel data acquisition front-end?
Two TLV2262AMJGB devices provide 4 independent op-amp channels, halving the IC count and PCB footprint compared to four single op-amps. With 0.8 nA max bias current per channel, all 4 inputs can be connected directly to 10 MΩ sensor sources without introducing more than 8 µV of offset error.
For a precision 16-bit data acquisition system, how does TLV2262AMJGB's offset voltage performance compare to general-purpose op-amps?
The TLV2262AMJGB offers input offset current as low as 0.06 pA and CMRR of 83 dB typical, which are required to keep total system error below 1 LSB at 16-bit resolution with a 5 V full-scale range—corresponding to a threshold of approximately 76 µV per bit.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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