TLV2262AMJGB Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock

Texas Instruments TLV2262AMJGB is a dual rail-to-rail operational amplifier with 70 dB min CMRR and 0.8 nA max bias current in a ceramic DIP package. It features voltage-feedback architecture with frequency compensation for stable single-supply operation. Available from stock worldwide with competitive pricing.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
TLV2262AMJGBCeramic Dual-In-Line Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Ceramic Dual-In-Line Packages
Pin Count
8
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Dual rail-to-rail input and output op-amp with 70 dB minimum common-mode rejection ratio for precision signal conditioning
  • Ultra-low 0.8 nA maximum input bias current enabling high-impedance sensor interfaces with minimal loading
  • Ceramic DIP package with MIL-grade reliability ratings for harsh-environment and space-qualified applications

Applications

The TLV2262AMJGB is designed for precision signal conditioning in military, aerospace, and high-reliability industrial applications where ceramic packaging and wide temperature range performance are mandatory. Its rail-to-rail output swing and low bias current make it suitable for instrumentation amplifiers, active filters, and sensor front-ends operating from a single 2.7 V to 8 V supply in harsh environments.

Specifications

Pbfree CodeYes
YTEOL15
Amplifier TypeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)0.0008 µA
Bias Current-Max (IIB) @25C0.00006 µA
Common-mode Reject Ratio-Min70dB
Common-mode Reject Ratio-Nom83dB
Frequency CompensationYES
Input Offset Current-Max (IIO)0.00006 µA
Input Offset Voltage-Max950 µV
JESD-30 CodeR-GDIP-T8
JESD-609 Codee0
Low-BiasYES
Low-OffsetNO
MicropowerYES
Number of Functions2
Package Body MaterialCERAMIC, GLASS-SEALED
Package Equivalence CodeDIP8,.3
Package ShapeRECTANGULAR
Package StyleIN-LINE
Packing MethodTUBE
PowerNO
Programmable PowerNO
Qualification StatusNot Qualified
Screening LevelMIL-STD-883
Slew Rate-Min0.25V/us
Slew Rate-Nom0.55V/us
SubcategoryOperational Amplifier
Supply Current-Max0.5mA
Supply Voltage Limit-Max16V
Supply Voltage-Nom (Vsup)3V
Surface MountNO
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishTin/Lead (Sn/Pb)
Terminal FormTHROUGH-HOLE
Terminal Pitch2.54mm
Terminal PositionDUAL
Unity Gain BW-Nom710
Voltage Gain-Min25000
WidebandNO
PackageCeramic Dual-In-Line Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8542.33.00.01

Datasheet

TLV2262AMJGB Datasheet Download

Official datasheet from Texas Instruments

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the common-mode rejection ratio of the TLV2262AMJGB and why does it matter in sensor applications?

The TLV2262AMJGB specifies a minimum CMRR of 70 dB and typical 83 dB. This level of common-mode rejection attenuates 50 Hz or 60 Hz interference by over 10,000:1, which is critical in bridge-sensor and thermocouple amplifier circuits where noise can corrupt small differential signals below 1 mV.

What makes the ceramic DIP package of TLV2262AMJGB suitable for harsh environments compared to plastic packages?

Ceramic DIP packages offer hermetic sealing that prevents moisture ingress, enabling operation across a -55°C to +125°C temperature range and meeting MIL-STD-883 screening requirements. Plastic PDIP packages absorb moisture and fail faster under thermal cycling, making ceramic essential for aerospace and defense systems.

How does the TLV2262AMJGB dual-channel configuration help reduce component count in a 4-channel data acquisition front-end?

Two TLV2262AMJGB devices provide 4 independent op-amp channels, halving the IC count and PCB footprint compared to four single op-amps. With 0.8 nA max bias current per channel, all 4 inputs can be connected directly to 10 MΩ sensor sources without introducing more than 8 µV of offset error.

For a precision 16-bit data acquisition system, how does TLV2262AMJGB's offset voltage performance compare to general-purpose op-amps?

The TLV2262AMJGB offers input offset current as low as 0.06 pA and CMRR of 83 dB typical, which are required to keep total system error below 1 LSB at 16-bit resolution with a 5 V full-scale range—corresponding to a threshold of approximately 76 µV per bit.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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