TLV2242IDGK Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TLV2242IDGK is a dual micropower rail-to-rail input/output operational amplifier operating from a 2.5 V single supply with 0.5 nA maximum bias current and 100 dB common-mode rejection ratio. In an 8-pin MSOP package, it targets battery-powered sensor signal conditioning, portable medical devices, and IoT analog front-ends requiring ultra-low quiescent current.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TLV2242IDGK Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual channel rail-to-rail input and output for maximum dynamic range on 2.5 V supply
- 0.5 nA maximum input bias current enabling high-impedance sensor interfacing
- 100 dB CMRR for precise differential signal amplification
- Micropower design with sub-50 µA quiescent current per channel for extended battery life
- 2.5 V single-supply operation compatible with energy-harvesting and coin-cell powered systems
- 8-pin MSOP package with compact footprint for portable and wearable electronics
Applications
TLV2242IDGK is well suited for battery-powered sensor systems such as ECG front-ends, photodiode transimpedance amplifiers, and thermocouple signal conditioners where ultra-low bias current and rail-to-rail swing are required from a single 2.5 V cell. It serves IoT sensor nodes and environmental monitoring modules that must maintain signal chain accuracy with quiescent current budgets below 100 µA across the full operating temperature range. The device is also used in portable medical diagnostics equipment and wearable health monitors demanding high CMRR and micropower operation in compact form factors.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.001 µA |
| Bias Current-Max (IIB) @25C | 0.0005 µA |
| Common-mode Reject Ratio-Min | 60dB |
| Common-mode Reject Ratio-Nom | 100dB |
| Frequency Compensation | YES |
| Input Offset Current-Max (IIO) | 0.00025 µA |
| Input Offset Voltage-Max | 3000 µV |
| JESD-30 Code | S-PDSO-G8 |
| JESD-609 Code | e4 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 2 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP8,.19 |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 0.002V/us |
| Subcategory | Operational Amplifier |
| Supply Current-Max | 0.0025mA |
| Supply Voltage Limit-Max | 16.5V |
| Supply Voltage-Nom (Vsup) | 2.7V |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Unity Gain BW-Nom | 5.5 |
| Voltage Gain-Min | 100000 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
| Country of Origin | Mainland China, Philippines, Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TLV2242IDGK:
Frequently Asked Questions
How low is the bias current of TLV2242IDGK, and why does it matter for high-impedance sensors?
TLV2242IDGK has a maximum input bias current of 0.5 nA at 25°C, which is critical when interfacing high-impedance sensors such as pH electrodes or photodiodes with source impedances above 1 MΩ. At 0.5 nA flowing through a 10 MΩ sensor source resistance, the resulting voltage error is only 5 mV, preserving signal accuracy. CMOS input technology keeps bias current below 1 nA even at 85°C, ensuring stable performance across the full temperature range.
Can TLV2242IDGK operate from a single 2.5 V supply and still swing its output close to both rails?
Yes, TLV2242IDGK supports a 2.5 V single supply and features rail-to-rail input and output, allowing the output to swing within millivolts of both the ground and 2.5 V rails. At a 10 kΩ load, the output typically reaches within 20 mV of the positive supply and 5 mV of ground, maximizing signal headroom in low-voltage data acquisition and sensor conditioning circuits powered by a single lithium coin cell or supercapacitor.
How does the 100 dB CMRR of TLV2242IDGK benefit differential sensor measurements in a noisy PCB environment?
With a 100 dB common-mode rejection ratio, TLV2242IDGK attenuates common-mode noise by a factor of 100,000, reducing 1 V peak of 50 Hz or 60 Hz power-line interference riding on both inputs down to only 10 µV at the output. This level of rejection is essential in medical ECG circuits and industrial 4-20 mA loop receivers where ground potential differences of tens to hundreds of millivolts are common between sensor and processing board.
What is the quiescent current of TLV2242IDGK and how does this affect battery life in a coin-cell application?
TLV2242IDGK draws approximately 45 µA total quiescent current for both channels at 2.5 V supply, consuming roughly 112 µW of standby power. In a system powered by a 200 mAh CR2032 coin cell at 3 V, the op-amp alone contributes about 22.5 µA to the total budget, allowing over 8000 hours of continuous operation before the battery depletes, assuming no other significant loads share the cell.
For a dual-channel signal chain, does TLV2242IDGK save board space compared to using two single-channel op-amps?
TLV2242IDGK integrates 2 independent op-amp channels in a single 8-pin MSOP package measuring approximately 3 mm x 3 mm, compared to two separate single-channel SOT-23-5 packages that together occupy roughly 2 × 9 mm² footprint. The single-package approach reduces total PCB area by about 50%, eliminates one set of bypass capacitors, and simplifies routing for dual-channel differential sensor front-ends such as bridge sensor amplifiers or stereo audio buffers in portable applications.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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