TLV172IDCKTAlternatives & Equivalent Parts

About TLV172IDCKT

TLV172IDCKT is a Integrated Circuit component manufactured by Texas Instruments. It comes in a SOT23 (5-Pin) package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterTLV172IDCKTSourceOPA2704EA/250CR0603-FX-1801ELFGRM21BR61A226ME51LSMBJ28CAQ-13-F
ManufacturerTexas InstrumentsTexas InstrumentsBournsMurata ElectronicsDiodes Inc.
Package TypeSOT23 (5-Pin)Small Outline PackagesResistor ChipOtherDiodes Moulded Non Polarised
Pin Count58222
Temperature Range-40.0°C ~ 125.0°C-40.0°C ~ 85.0°C-55.0°C ~ 155.0°C-55.0°C ~ 85.0°C-55.0°C ~ 150.0°C
Price$0.5915$0.7370$0.0013$0.0260$0.1007
StockIn StockIn StockIn StockIn StockIn Stock
LifecycleACTIVEACTIVEACTIVEACTIVEACTIVE
Electrical Parameters
Pbfree CodeYesYesYes
Date Of Intro2016-11-132018-10-24
YTEOL15151377
Amplifier TypeOPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACKVOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min100 dB70 dB
Common-mode Reject Ratio-Nom116 dB90 dB
Frequency CompensationYESYES (AVCL>=5)
Input Offset Voltage-Max1700 µV750 µV
JESD-30 CodeR-PDSO-G5S-PDSO-G8R-PDSO-C2
JESD-609 Codee4e4e3e3e3
Low-BiasNOYES
Low-OffsetNOYES
MicropowerNOYES
Neg Supply Voltage Limit-Max-20 V-6.6 V
Neg Supply Voltage-Nom (Vsup)-15 V-5 V
Number of Functions12
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package ShapeRECTANGULARSQUARERECTANGULAR PACKAGERECTANGULAR PACKAGERECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMTSMTSMALL OUTLINE
Packing MethodTRTRTR, PAPER, 7 INCH180mm Reel W8P4
Peak Reflow Temperature (Cel)260260260
PowerNONO
Programmable PowerNONO
Slew Rate-Nom10 V/us3 V/us
Supply Current-Max2.3 mA0.4 mA
Supply Voltage Limit-Max20 V6.6 V
Supply Voltage-Nom (Vsup)15 V5 V
Surface MountYESYESYESYESYES
TechnologyCMOSCMOSMETAL GLAZE/THICK FILMAVALANCHE
Temperature GradeAUTOMOTIVEINDUSTRIAL
Terminal FinishNickel/Palladium/Gold (Ni/Pd/Au)Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)TIN OVER NICKELMatte Tin (Sn) - with Nickel (Ni) barrierMATTE TIN
Terminal FormGULL WINGGULL WINGC BEND
Terminal Pitch0.65 mm0.65 mm
Terminal PositionDUALDUALDUAL
Time@Peak Reflow Temperature-Max (s)3030
Unity Gain BW-Nom100003000
Voltage Gain-Min7079463100
WidebandNONO
Average Bias Current-Max (IIB)0.00001 µA
Bias Current-Max (IIB) @25C0.00001 µA
Input Offset Current-Max (IIO)0.00001 µA
Package Equivalence CodeTSSOP8,.19
Qualification StatusNot Qualified
## OPA2704EA/250 Alternates Showing resultsImage
Reach Compliance CodeCompliantCompliant
Factory Lead Time12 Weeks10 Weeks12 Weeks
ConstructionRectangular
Mounting FeatureSURFACE MOUNTSURFACE MOUNT
Package Height0.45 mm
Package Length1.6 mm
Package Width0.8 mm
Rated Power Dissipation (P)0.1 W
Rated Temperature70 °C
Resistance1800 Ω
Resistor TypeFIXED RESISTOR
Size Code06032012M/0805
Temperature Coefficient100 ppm/°C15% ppm/°C
Terminal ShapeWRAPAROUNDWRAPAROUND
Tolerance1%
Working Voltage75 V
Capacitance22 µF
Capacitor TypeCERAMIC CAPACITOR
Dielectric MaterialCERAMIC
Height1.25 mm
MultilayerYES
Negative Tolerance20%
Positive Tolerance20%
Rated (DC) Voltage (URdc)10 V
Temperature Characteristics CodeX5R
Additional FeatureEXCELLENT CLAMPING CAPABILITY
Breakdown Voltage-Max35.8 V
Breakdown Voltage-Min31.1 V
Breakdown Voltage-Nom33.45 V
Clamping Voltage-Max45.4 V
ConfigurationSINGLE
Diode Element MaterialSILICON
Diode TypeTRANS VOLTAGE SUPPRESSOR DIODE
Non-rep Peak Rev Power Dis-Max600 W
Number of Elements1
PolarityBIDIRECTIONAL
Power Dissipation-Max5 W
Reference StandardAEC-Q101; IATF 16949; MIL-STD-202
Rep Pk Reverse Voltage-Max28 V
Reverse Current-Max5 µA
Reverse Test Voltage28 V

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 4 alternatives for TLV172IDCKT — response within 24 hours.

Quick Links

Why Look for Alternatives?

Finding alternatives for TLV172IDCKT is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating TLV172IDCKT replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to TLV172IDCKT?

Known equivalents for TLV172IDCKT include OPA2704EA/250, CR0603-FX-1801ELF, GRM21BR61A226ME51L. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of TLV172IDCKT?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify TLV172IDCKT alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.