TLV1702AQDGKRQ1Alternatives & Equivalent Parts
About TLV1702AQDGKRQ1
TLV1702AQDGKRQ1 is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | TLV1702AQDGKRQ1Source | TLV1702AIDGK | TLV1702AIDGKR |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments |
| Package Type | Small Outline Packages | Small Outline Packages | Small Outline Packages |
| Pin Count | 8 | 8 | 8 |
| Temperature Range | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C |
| Price | $0.8742 | $0.6534 | — |
| Electrical Parameters | |||
| Pbfree Code | Yes | Yes | Yes |
| YTEOL | 15 | 15 | 15 |
| Amplifier Type | COMPARATOR | COMPARATOR | COMPARATOR |
| Average Bias Current-Max (IIB) | 0.02 µA | 20 µA | 20 µA |
| Bias Current-Max (IIB) @25C | 0.015 µA | 0.015 µA | 0.015 µA |
| Input Offset Voltage-Max | 2500 µV | 2500 µV | 2500 µV |
| JESD-30 Code | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609 Code | e4 | e4 | e4 |
| Number of Functions | 2 | 2 | 2 |
| Output Type | OPEN-COLLECTOR; OPEN-DRAIN | OPEN-COLLECTOR; OPEN-DRAIN | OPEN-COLLECTOR; OPEN-DRAIN |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Shape | SQUARE | SQUARE | SQUARE |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 | 260 | 260 |
| Response Time-Nom | 560 ns | 560 ns | 560 ns |
| Screening Level | AEC-Q100 | — | — |
| Supply Current-Max | 0.15 mA | 0.15 mA | 0.15 mA |
| Supply Voltage Limit-Max | 40 V | 40 V | 40 V |
| Surface Mount | YES | YES | YES |
| Technology | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature Grade | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING | GULL WING | GULL WING |
| Terminal Pitch | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal Position | DUAL | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | 30 | 30 |
| Package Equivalence Code | — | TSSOP8,.19 | TSSOP8,.19 |
| Packing Method | — | TUBE | TR |
| Qualification Status | — | Not Qualified | Not Qualified |
| Subcategory | — | Comparator | Comparator |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Quick Links
Comparator, 2 Func, 2500uV Offset-Max, 560ns Response Time, BIPolar, PDSO8
Comparator, 2 Func, 2500uV Offset-Max, 560ns Response Time, BIPolar, PDSO8
Why Look for Alternatives?
Finding alternatives for TLV1702AQDGKRQ1 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLV1702AQDGKRQ1 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
Can't Find What You Need?
Our sourcing team can help find compatible alternatives for TLV1702AQDGKRQ1. Get expert recommendations within 24 hours.
Request Alternatives for TLV1702AQDGKRQ1FAQ
What is equivalent to TLV1702AQDGKRQ1?
Known equivalents for TLV1702AQDGKRQ1 include TLV1702AIDGK, TLV1702AIDGKR. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLV1702AQDGKRQ1?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLV1702AQDGKRQ1 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.