TLP705AF(F) Toshiba Integrated Circuit (Small Outline Packages) In Stock
TLP705AF(F) is a Toshiba integrated circuit for industrial, embedded, and repair-oriented electronic assemblies. Key specs include 5000 V, 0.025 A, 6 pins. From quote-based pricing, check in-stock availability with worldwide shipping.
- Manufacturer
- Toshiba
- Package
- Small Outline Packages
- Pin Count
- 6
- Lifecycle
- OBSOLETE
- Datasheet
- TLP705AF(F) Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 5000 V key rating for integrated circuit selection
- 6-pin Small Outline Packages footprint support for PCB and BOM matching
- 0.025 A specification helps qualify alternates and replacements
- Designed for industrial, embedded, and repair-oriented electronic assemblies using 6 pins
Applications
TLP705AF(F) is commonly used in industrial, embedded, and repair-oriented electronic assemblies where designers need 5000 V and reliable sourcing continuity. It is also useful for repair, replacement, and production BOMs that must preserve the 6-pin Small Outline Packages format and 0.025 A requirement.
Specifications
| YTEOL | 0 |
| Additional Feature | UL RECOGNIZED |
| Configuration | SINGLE |
| Forward Current-Max | 0.025A |
| Isolation Voltage-Max | 5000V |
| Mounting Feature | SURFACE MOUNT |
| Number of Elements | 1 |
| Number of Functions | 1 |
| Optoelectronic Device Type | LOGIC IC OUTPUT OPTOCOUPLER |
| Response Time-Max | 2e-7 s |
| Response Time-Nom | 1.25e-7 ns |
| Supply Voltage-Min | 10V |
| Surface Mount | YES |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8541.40.80.00 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for TLP705AF(F) with 5000 V?
TLP705AF(F) fits industrial, embedded, and repair-oriented electronic assemblies when the design needs 5000 V and 0.025 A. It is a practical choice when the BOM also matches the 6-pin Small Outline Packages footprint.
How should engineers check package compatibility for TLP705AF(F)?
Compare the PCB land pattern, height allowance, and assembly process against the 6-pin Small Outline Packages style. The 6 pins detail is the first check before approving a replacement.
What matters when sourcing TLP705AF(F) as a replacement?
Confirm the same 5000 V, 0.025 A, manufacturer traceability, and lifecycle status before substituting it. Buyers should also verify stock for the exact 6-pin Small Outline Packages configuration.
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