TLP701(TP,F) Toshiba Integrated Circuit (Small Outline Packages) In Stock
Toshiba TLP701(TP,F) is a single-channel logic IC output optocoupler with 5000 V isolation voltage in a surface-mount package. It provides high-speed logic-level signal isolation with a maximum forward input current of 20 mA, making it ideal for gate drive and digital isolation in power electronics. UL approved and tape-packaged for automated SMT assembly.
- Manufacturer
- Toshiba
- Package
- Small Outline Packages
- Pin Count
- 6
- Lifecycle
- OBSOLETE
- Datasheet
- TLP701(TP,F) Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 5000 V isolation voltage ensures robust galvanic separation between input and output circuits
- Logic IC output stage delivers clean digital signal levels compatible with standard CMOS and TTL logic
- Single-channel configuration simplifies PCB layout for point-to-point optocoupled signal isolation
- 20 mA maximum forward input current allows flexible LED drive from microcontrollers and gate drivers
- Surface-mount tape packaging supports automated pick-and-place assembly in high-volume production
Applications
The TLP701(TP,F) is used as a signal isolation interface in power converter gate drive circuits, industrial I/O modules, and motor inverter control boards where 5000 V galvanic isolation between the control logic and high-voltage power stage is required. Its logic IC output makes it directly compatible with digital PWM signals from microcontrollers and DSP gate drive outputs operating at 3.3 V or 5 V logic levels. The UL-approved single-channel SMT design suits safety-critical applications in medical equipment power supplies and industrial automation controllers.
Specifications
| YTEOL | 0 |
| Additional Feature | UL APPROVED |
| Configuration | SINGLE |
| Forward Current-Max | 0.02A |
| Isolation Voltage-Max | 5000V |
| Mounting Feature | SURFACE MOUNT |
| Number of Elements | 1 |
| Number of Functions | 1 |
| Optoelectronic Device Type | LOGIC IC OUTPUT OPTOCOUPLER |
| Packing Method | TAPE |
| Response Time-Nom | 5e-8 ns |
| Supply Voltage-Min | 10V |
| Surface Mount | YES |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8541.40.80.00 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What isolation voltage does the TLP701(TP,F) provide and why does it matter in power converter designs?
The TLP701(TP,F) is rated for 5000 V isolation voltage between the LED input and the logic IC output. This level of galvanic isolation is required in power converters where the gate drive signal for a high-side IGBT or MOSFET must cross from a low-voltage control ground to a floating half-bridge node that can swing several hundred volts during normal switching operation, preventing damage to control electronics.
How does the logic IC output of TLP701(TP,F) differ from a phototransistor output in a standard optocoupler?
A standard phototransistor optocoupler output delivers an analog collector current that requires external pull-up resistors and has limited switching bandwidth due to transistor storage time. The TLP701(TP,F) uses an integrated logic IC output stage that produces clean rail-to-rail digital logic levels compatible with 3.3 V or 5 V CMOS, with defined propagation delay and rise/fall times, making it directly usable as a digital signal isolator without additional conditioning circuitry.
What forward input current does TLP701(TP,F) require and which microcontrollers can drive it directly?
The TLP701(TP,F) has a maximum LED forward current of 20 mA. Most 3.3 V and 5 V microcontroller GPIO pins can source or sink 8 mA to 25 mA, so a simple series resistor of approximately 100 Ω to 220 Ω sets the LED current to a safe operating level. This eliminates the need for a dedicated driver transistor stage between the MCU and the optocoupler input.
Is the TLP701(TP,F) suitable for high-volume automated PCB assembly and what packaging format does it use?
Yes, the TLP701(TP,F) is available in tape-on-reel packaging (TP suffix) specifically designed for automated SMT pick-and-place equipment. The surface-mount package footprint is compatible with standard SMT reflow processes, and the tape format ensures consistent feeder loading across production batches of thousands of units per reel, reducing manual handling and placement errors.
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