TLP701(F) Toshiba Integrated Circuit (Small Outline Packages) In Stock
TLP701(F) is a DC input, IC output optocoupler from Toshiba in a surface-mount 6-pin SDIP package, providing high-speed gate drive isolation for power MOSFETs and IGBTs. It delivers a typical propagation delay of 100 ns and supports an output supply voltage up to 30 V, enabling reliable switching at frequencies up to 1 MHz. Available in stock worldwide at competitive pricing with fast shipping.
- Manufacturer
- Toshiba
- Package
- Small Outline Packages
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- TLP701(F) Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- High-speed DC optocoupler with approximately 100 ns propagation delay, enabling gate driver isolation for MOSFETs and IGBTs switching at frequencies up to 1 MHz
- IC output stage with output supply voltage up to 30 V and peak output current of ±2.5 A for direct gate drive of medium-power switching transistors
- 6-pin SDIP surface-mount package with reinforced isolation between input LED and IC output, suitable for compact gate driver board designs
Applications
The TLP701(F) is used in switch-mode power supplies, motor drive inverters, and industrial servo controllers where isolated gate drive signals must switch IGBTs or power MOSFETs at up to 1 MHz with less than 100 ns delay. Its IC output stage with peak current drive capability makes it a compact single-package solution for replacing discrete optocoupler-plus-gate-driver combinations in half-bridge and full-bridge power converter designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum switching frequency and propagation delay of the TLP701(F) in a gate driver application?
The TLP701(F) has a typical propagation delay of approximately 100 ns and supports switching frequencies up to 1 MHz. This makes it suitable for high-frequency IGBT and MOSFET gate drive circuits in switch-mode power supplies and DC-DC converters where fast, jitter-free switching transitions are needed to minimize switching losses at elevated frequencies above 100 kHz.
What output drive capability does the TLP701(F) provide for IGBT or MOSFET gate charging?
The TLP701(F) IC output stage delivers a peak output current of ±2.5 A with an output supply voltage range up to 30 V. This peak current is sufficient to charge and discharge the gate capacitance of medium-power IGBTs or MOSFETs with Qg up to 100 nC within the 100 ns propagation delay window, enabling fast-switching transitions without an external gate driver buffer stage.
How does the isolation architecture of the TLP701(F) protect low-voltage control circuits in a motor drive?
The TLP701(F) uses an LED-input to IC-output photocoupling architecture that galvanically isolates the 3.3 V or 5 V MCU control signal from the high-voltage IGBT gate drive circuit at bus voltages up to several hundred volts. This prevents common-mode transients generated by the switching IGBT from coupling back into the microcontroller, protecting the DSP or FPGA gate driver logic from voltages exceeding its 30 V absolute maximum rating.
What are the board space and package advantages of the TLP701(F) SDIP-6 form factor compared to a DIP optocoupler?
The 6-pin SDIP surface-mount package of the TLP701(F) reduces board footprint by approximately 50% compared to a through-hole DIP-6 optocoupler of the same function, since it eliminates through-hole drilling and enables placement on both sides of a double-sided PCB. The SDIP form factor also lowers profile height to under 2.5 mm, which is critical in thin-board power converter designs constrained to total PCB stack heights below 10 mm.
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