TLP521-1Alternatives & Equivalent Parts

TLP521-1 is marked OBSOLETE. Compare the equivalents below, check each part's lifecycle, and request a quote on a suitable replacement.

About TLP521-1

TLP521-1 is a Integrated Circuit component manufactured by Toshiba. It comes in a Dual-In-Line Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterTLP521-1SourceEZJ-P0V101BMLM239DBTA26-600BRG
ManufacturerToshibaPanasonicTexas InstrumentsSTMicroelectronics
Package TypeDual-In-Line PackagesOtherSmall Outline PackagesTransistor Outline, Vertical
Pin Count42143
Temperature Range-25.0°C ~ 85.0°C-40.0°C ~ 105.0°C-40.0°C ~ 125.0°C
Price$0.1240$0.0590$0.0952$1.0500
StockIn StockIn StockIn StockIn Stock
LifecycleOBSOLETEACTIVEACTIVE
Electrical Parameters
YTEOL05.576
Additional FeatureUL RECOGNIZEDUL RECOGNIZED
Coll-Emtr Bkdn Voltage-Min55 V
ConfigurationSINGLESINGLE
Current Transfer Ratio-Min70%
Current Transfer Ratio-Nom50%
Dark Current-Max100 nA
Forward Current-Max0.025 A
Forward Voltage-Max1.3 V
Isolation Voltage-Max2500 V
Mounting FeatureTHROUGH HOLE MOUNT
Number of Elements11
On-State Current-Max0.05 A
Optoelectronic Device TypeTRANSISTOR OUTPUT OPTOCOUPLER
Power Dissipation-Max0.2 W
Response Time-Max0.000006 s
Surface MountNOYESNO
Factory Lead Time8 Weeks16 Weeks
Amplifier TypeCOMPARATOR
Average Bias Current-Max (IIB)0.4 µA
Bias Current-Max (IIB) @25C0.25 µA
Input Offset Voltage-Max9000 µV
JESD-30 CodeR-PDSO-G14R-PSFM-T3
JESD-609 Codee3e3
Number of Functions4
Output TypeOPEN-COLLECTOR
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeSOP14,.25
Package ShapeRECTANGULARRECTANGULAR
Package StyleSMALL OUTLINEFLANGE MOUNT
Packing MethodTUBE
Peak Reflow Temperature (Cel)260
Qualification StatusNot QualifiedNot Qualified
Response Time-Nom1300 ns
Supply Current-Max2 mA
Supply Voltage Limit-Max32 V
Supply Voltage-Nom (Vsup)5 V
TechnologyBIPOLAR
Temperature GradeINDUSTRIAL
Terminal FinishMatte Tin (Sn) - annealedMatte Tin (Sn) - annealed
Terminal FormGULL WINGTHROUGH-HOLE
Terminal Pitch1.27 mm
Terminal PositionDUALSINGLE
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
## LM239D Alternates Showing resultsImage
Case ConnectionISOLATED
Critical Rate of Rise of Commutation Voltage-Min10 V/us
Critical Rate of Rise of Off-State Voltage-Min250 V/us
DC Gate Trigger Current-Max50 mA
DC Gate Trigger Voltage-Max1.5 V
Holding Current-Max80 mA
Leakage Current-Max3 mA
RMS On-state Current-Max25 A
Reference StandardUL RECOGNIZED
Repetitive Peak Off-state Leakage Current-Max10 µA
Repetitive Peak Off-state Voltage600 V
Trigger Device Type4 QUADRANT LOGIC LEVEL TRIAC

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 3 alternatives for TLP521-1 — response within 24 hours.

Quick Links

Why Look for Alternatives?

Finding alternatives for TLP521-1 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating TLP521-1 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to TLP521-1?

Known equivalents for TLP521-1 include EZJ-P0V101BM, LM239D, BTA26-600BRG. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of TLP521-1?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify TLP521-1 alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.