TLP293-4(LGB,E Toshiba Integrated Circuit (Small Outline Packages) In Stock
TLP293-4(LGB,E is a Toshiba Integrated Circuit for electronic assemblies, maintenance sourcing, and production builds. It combines -55°C to 125°C, 16 pins, and Small Outline Packages package, 16-pin layout, -55°C to 125°C operation for practical design qualification. From request-a-quote sourcing, FindMyChip supports stock checks and worldwide shipping.
- Manufacturer
- Toshiba
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- TLP293-4(LGB,E Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $0.5357(MOQ 200)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- -55°C to 125°C specification for integrated circuit design checks
- Small Outline Packages package, 16-pin layout, -55°C to 125°C operation for footprint and assembly planning
- 16 pins context captured from supplier data for buyer comparison
- Suitable for electronic assemblies, maintenance sourcing, and production builds with documented manufacturer sourcing
- 14 W detail available for technical screening
Applications
TLP293-4(LGB,E is commonly considered for electronic assemblies, maintenance sourcing, and production builds where buyers need manufacturer-traceable component data and a practical package choice. It is suitable for maintenance, prototype, and production sourcing workflows that compare electrical ratings, package fit, and lifecycle risk before purchase.
Specifications
| Factory Lead Time | 14Weeks |
| YTEOL | 8 |
| Additional Feature | UL RECOGNIZED |
| Coll-Emtr Bkdn Voltage-Min | 80V |
| Configuration | SEPARATE, 4 CHANNELS |
| Current Transfer Ratio-Min | 100% |
| Dark Current-Max | 80nA |
| Forward Current-Max | 0.05A |
| Forward Voltage-Max | 1.4V |
| Isolation Voltage-Max | 3750V |
| Mounting Feature | SURFACE MOUNT |
| Number of Elements | 4 |
| On-State Current-Max | 0.05A |
| Optoelectronic Device Type | TRANSISTOR OUTPUT OPTOCOUPLER |
| Power Dissipation-Max | 0.1W |
| Response Time-Max | 0.000002s |
| Surface Mount | YES |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A001.a.2.c |
| HTS Code | 8541.40.80.00 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TLP293-4(LGB,E:
Frequently Asked Questions
Which design role does TLP293-4(LGB,E fill in integrated circuit assemblies?
TLP293-4(LGB,E is selected for electronic assemblies, maintenance sourcing, and production builds, with -55°C to 125°C as a useful design-screening value and Small Outline Packages supporting layout review.
How should engineers check package fit before using TLP293-4(LGB,E?
Start with the Small Outline Packages package and 16 pins, then confirm footprint, height, and manufacturing constraints against the target PCB assembly.
What sourcing details matter when buyers compare TLP293-4(LGB,E alternatives?
Buyers should compare lifecycle status, manufacturer traceability, and the 16 pins specification while confirming stock availability and worldwide shipping options.
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Why Buy from FindMyChip
About Toshiba
Toshiba is a leading electronic component manufacturer. FindMyChip sources Toshiba ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 200+ | $0.5413 | $108.25 |
| 400+ | $0.5385 | $215.39 |
| 800+ | $0.5357 | $428.54 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
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